EPF10K200SBC600-1 vs EPF10K200EBC600-1 Comparación
Comparación detallada lado a lado de EPF10K200SBC600-1 por Intel y EPF10K200EBC600-1 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Intel
EPF10K200SBC600-1 - 200K Gate FLEX-10KS FPGA, 470 I/O | Intel / Altera
EPF10K200SBC600-1 ObsoleteIntel
EPF10K200EBC600-1 - 9984-Cell, 2.5V FPGA | Intel | Embedded Systems
EPF10K200EBC600-1 ObsoleteComparación de especificaciones
| Parámetro | EPF10K200SBC600-1 | EPF10K200EBC600-1 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Obsolete | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $425,00 | $322,17 |
| Family | FLEX-10KS | — |
| Series | EPF10K200 | — |
| Logic Elements / Cells | 9,984 | — |
| Gate Count (typical) | 200,000 gates | — |
| Logic Array Blocks (LABs) | 1,248 | — |
| Number of User I/Os | 470 | — |
| Number of Logic Cells | 4,992 | — |
| Embedded RAM (bits) | 24,576 (across EABs) | — |
| Max Internal Frequency | 250 MHz | — |
| Propagation Delay | 0.4 ns | 0.4 ns |
| Process Technology | 0.22 µm CMOS | — |
| Core Supply Voltage (VCCINT) | 2.375 V to 2.625 V (typ. 2.5 V) | — |
| Speed Grade | -1 (fastest commercial) | — |
| Temperatura de funcionamiento | 0 °C to 70 °C (Commercial) | — |
| Encapsulado | 600-ball BGA, 45 × 45 mm, 1.27 mm pitch | 600-BGA |
| Tipo de montaje | Surface Mount | — |
| JTAG Support | IEEE Std 1149.1 | — |
| Configuration | Serial via EPC2/EPC8 configuration devices | — |
| Estado RoHS | Non-compliant (per third-party listing) | unknown |
| Product Type | — | Field Programmable Gate Array (FPGA) |
| Device Family | — | FLEX-10KE |
| Logic Elements | — | 9,984 |
| Embedded Memory | — | 98,304 bits |
| Logic Array Blocks | — | 1,248 LABs |
| I/O Count | — | 470 I/O |
| Tensión de alimentación | — | 2.5 V |
| Technology | — | Mixed CMOS |
| Commercial Temperature | — | 85 C |
| Embedded Array | — | Enhanced embedded array |
| Memory Feature | — | Dual-port memory |
| Configuration Interface | — | [DATA_NEEDED: configuration interface] |
| Package Dimensions | — | [DATA_NEEDED: package dimensions] |
| Operating Current | — | [DATA_NEEDED: operating current] |
| Pinout | — | [DATA_NEEDED: 600-BGA ball map] |
| Moisture Sensitivity Level | — | [DATA_NEEDED: MSL level] |