EPF10K30EQC208-2 vs EPF10K30EQC208-1 Comparación
Comparación detallada lado a lado de EPF10K30EQC208-2 por Intel y EPF10K30EQC208-1 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EPF10K30EQC208-2 | EPF10K30EQC208-1 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Obsolete | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $17,85 | $17,95 |
| Family | FLEX 10KE | FLEX 10K |
| Logic Elements | 1,728 | — |
| Typical Gates | 30,000 | — |
| Logic Array Blocks (LABs) | 216 | 216 |
| Embedded Array Blocks (EABs) | 6 (24 Kbits total) | 6 (2,048 bits each) |
| Embedded Memory (bits) | 24,576 | — |
| Maximum User I/O | 147 | — |
| Process Technology | 0.22 µm CMOS | 0.30 µm CMOS SRAM |
| Core Supply Voltage | 2.5 V | — |
| Speed Grade | -2 | — |
| Temperatura de funcionamiento | Commercial (0 °C to +70 °C) | 0 °C to +70 °C (Commercial) |
| Encapsulado | 208-pin PQFP (Plastic Quad Flat Pack) | 208-BQFP (PQFP) 28×28 mm |
| Package Dimensions | 30.60 mm × 30.60 mm, 0.50 mm pitch | — |
| Maximum Internal Frequency | 200 MHz | — |
| Tipo de montaje | Surface Mount (gull-wing leads) | Surface Mount (Gull-Wing) |
| Programmability | SRAM-based, JTAG/ISP | — |
| Estado RoHS | Non-compliant (legacy PQFP package) | Not RoHS compliant (SnPb lead finish on BQFP) |
| Series | — | FLEX 10KE |
| Logic Elements / Cells | — | 1,728 |
| Total Gates | — | 30,000 (typical), 119,000 (maximum) |
| Total RAM Bits | — | 24,576 |
| User I/Os | — | 147 |
| Core Voltage | — | 2.5 V (2.375 V–2.625 V) |
| I/O Voltage | — | 5.0 V tolerant |
| Internal Frequency | — | 80 MHz (max) |
| Propagation Delay | — | 0.6 ns (typ) |
| Configuration Interface | — | JTAG (IEEE 1149.1) + Serial (EPC compatible) |