EPF10K30EQC208-3N vs EPF10K30EQC208-1N Comparación
Comparación detallada lado a lado de EPF10K30EQC208-3N por Intel y EPF10K30EQC208-1N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Intel
EPF10K30EQC208-3N - 30K Gates FLEX 10KE FPGA, 208-PQFP | Intel
EPF10K30EQC208-3N ⚠ Última compraComparación de especificaciones
| Parámetro | EPF10K30EQC208-3N | EPF10K30EQC208-1N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Última compra | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $49,10 | $28,40 |
| Family | FLEX 10KE | FLEX 10KE |
| Logic Elements / Cells | 1,728 | 1,728 |
| Typical Gates | 30,000 | — |
| Total RAM Bits | 24,576 | 24,576 |
| Logic Array Blocks (LABs) | 216 | — |
| User I/Os | 147 | — |
| Number of I/O Banks | [DATA_NEEDED: number of I/O banks] | — |
| Internal Frequency | 200 MHz | — |
| Propagation Delay | 0.6 ns (typical) | 0.6 ns |
| Core Voltage | 2.5 V | — |
| Process Technology | 0.22 µm CMOS | 0.22 µm CMOS |
| Temperatura de funcionamiento | 0 °C to +70 °C (commercial) | 0 C to 70 C (commercial) |
| Encapsulado | 208-pin PQFP (BFQFP, plastic) | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Configuration Memory | SRAM (volatile, requires external PROM) | — |
| JTAG Support | IEEE 1149.1 boundary-scan | — |
| Lead-Free / RoHS | Lead-free per package marking; RoHS compliance [DATA_NEEDED] | — |
| Typical Gate Count | — | 30,000 gates |
| Number of LABs / CLBs | — | 216 |
| Number of User I/O | — | 147 |
| Number of Gates | — | 119,000 |
| Internal Frequency (max) | — | 250 MHz |
| Core Voltage VCCINT | — | 2.375 V to 2.625 V (nominal 2.5 V) |
| Encapsulado / Carcasa | — | 208-BFQFP (PQFP-208, 28x28 mm) |
| Configuration Method | — | SRAM-based, ISP via JTAG |
| Part Status | — | Obsolete (last-time-buy may apply) |