EPF10K30ETC144-2 vs EPF10K30ETI144-3 Comparación
Comparación detallada lado a lado de EPF10K30ETC144-2 por Intel y EPF10K30ETI144-3 por Altera. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EPF10K30ETC144-2 | EPF10K30ETI144-3 |
|---|---|---|
| Marca | Intel | Altera |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Obsolete | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $37,80 | $29,80 |
| Series | FLEX 10KE | FLEX-10KE |
| Family | FLEX 10KE | FLEX-10KE Embedded Programmable Logic Device |
| Logic Elements | 1,728 | 1728 |
| Typical Gates | 30,000 | — |
| Maximum User I/Os | 102 | — |
| Logic Array Blocks (LABs) | 216 | 216 |
| Embedded Memory Bits | 24,576 | — |
| Embedded Array Blocks (EABs) | 6 | 6 |
| Encapsulado | 144-LQFP (TQFP, 20x20 mm) | 144-LQFP (LFQFP) |
| Speed Grade | -2 | — |
| Temperatura de funcionamiento | 0C to +70C (Commercial) | -40C to +85C (Industrial) |
| Core Voltage (VCCINT) | 2.5 V (2.375 V to 2.625 V) | — |
| I/O Voltage (VCCIO) | 2.5 V / 3.3 V / 5.0 V (MultiVolt) | — |
| Internal Frequency | up to 80 MHz | — |
| Propagation Delay (typ.) | 0.6 ns | — |
| Configuration Method | SRAM, JTAG (IEEE 1149.1) | SRAM (volatile) + JTAG IEEE 1149.1 |
| Process Technology | CMOS, SRAM-based | — |
| Tipo de montaje | Surface Mount | Surface Mount (Gull Wing) |
| Estado RoHS | Compliant (lead-free) | Non-Compliant (Sn/Pb lead finish) |
| Embedded RAM | — | 24,576 bits |
| Maximum User I/O | — | 102 |
| Maximum Equivalent Gates | — | 119,000 |
| Pin-to-Pin Delay (Speed Grade) | — | 12.5 ns |
| Supply Voltage (Core) | — | 2.5 V / 3.3 V |
| I/O Voltage Tolerance | — | 5.0 V / 3.3 V / 2.5 V (multi-volt) |
| Package Height | — | 1.6 mm |
| Lead Finish | — | Tin/Lead (Sn/Pb) |