EPF10K50EQC208-3 vs EPF10K50SQC208-3 Comparación
Comparación detallada lado a lado de EPF10K50EQC208-3 por Intel y EPF10K50SQC208-3 por Altera. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EPF10K50EQC208-3 | EPF10K50SQC208-3 |
|---|---|---|
| Marca | Intel | Altera |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Obsolete | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $18,20 | $23,10 |
| Family | FLEX 10KE (EPF10K50E) | FLEX 10K |
| Typical Gate Count | 50,000 gates | — |
| Logic Elements | 2,880 | — |
| Embedded Memory (EAB) | 40,960 bits | — |
| Logic Array Blocks (LABs) | 360 | 360 |
| User I/Os | 147 | 147 |
| Maximum Internal Frequency | 166.67 MHz | — |
| Propagation Delay | 0.6 ns (per DigChip) | — |
| Core Supply Voltage | 2.3 V to 2.7 V (2.5 V typical) | 2.5 V |
| I/O Supply Voltage | 3.3 V or 5.0 V | — |
| Temperatura de funcionamiento | 0 °C to +70 °C (Commercial) | 0 °C to 70 °C (Commercial) |
| Encapsulado | 208-BFQFP (PQFP), 28 × 28 mm | 208-BFQFP / PQFP (28x28 mm) |
| Tipo de montaje | Surface Mount | Surface Mount (gull wing) |
| Nivel MSL | [DATA_NEEDED: MSL Level] | — |
| Configuration Method | SRAM, volatile (requires EPC boot device) | — |
| Process Technology | 0.22 µm CMOS, SRAM-based | 0.22 µm CMOS |
| Estado del ciclo de vida | Obsolete (per Rocelec / Altera PCN history) | — |
| Series | — | FLEX-10KS |
| Typical Gates | — | 50,000 |
| Logic Cells / Elements | — | 2,880 |
| Embedded Memory (Bits) | — | 40,960 |
| Internal Frequency (max) | — | 166.67 MHz |
| Propagation Delay (typ) | — | 0.6 ns |
| Configuration Technology | — | SRAM-based, reprogrammable |
| Estado RoHS | — | [DATA_NEEDED: RoHS status] |