EPF10K50EQC240-2 vs EPF10K50EQC240-3N Comparación
Comparación detallada lado a lado de EPF10K50EQC240-2 por Intel y EPF10K50EQC240-3N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EPF10K50EQC240-2 | EPF10K50EQC240-3N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Última compra | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $65,00 | $59,50 |
| Family | FLEX-10KE | FLEX 10K |
| Logic Elements (Cells) | 2,880 | — |
| System Gates | 50,000 (40,960 typical) | — |
| Logic Array Blocks (LABs) | 360 | 360 |
| Embedded Array Blocks (EABs) | 12 | — |
| Total RAM Bits | 20,480 bits | — |
| User I/O Pins | 189 | — |
| Maximum Operating Frequency | 200 MHz | — |
| Core Voltage | 2.5 V | — |
| Process Technology | 0.22 µm CMOS | 0.22 µm CMOS SRAM |
| Encapsulado | 240-BFQFP / PQFP-240 (34.6 × 34.6 mm, 0.5 mm pitch) | — |
| Temperatura de funcionamiento | 0 °C to +70 °C (Commercial) | 0 °C to +70 °C (Commercial) |
| Programming Interface | IEEE 1149.1 JTAG, Serial EPROM (PS / AS) | — |
| Configuration Memory | SRAM (volatile) | — |
| Tipo de montaje | Surface Mount (gull-wing leads) | Surface Mount |
| Estado RoHS | [DATA_NEEDED: rohs status from manufacturer] | Compliant |
| Series | — | FLEX 10KE |
| Logic Elements / Cells | — | 2,880 |
| Total Gates | — | 50,000 (typical) |
| Number of I/O | — | 189 |
| Embedded Memory (bits) | — | 40,960 |
| Supply Voltage - Core | — | 2.5 V |
| Maximum Internal Frequency | — | 166.67 MHz |
| Speed Grade | — | -3 |
| Encapsulado / Carcasa | — | 240-BFQFP (PQFP), 32.1 × 32.1 mm |
| Configuration Method | — | SRAM, JTAG, EPC2/EPC8 supported |