EPF10K50RC240-4 vs EPF10K70RC240-2 Comparación
Comparación detallada lado a lado de EPF10K50RC240-4 por Altera y EPF10K70RC240-2 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EPF10K50RC240-4 | EPF10K70RC240-2 |
|---|---|---|
| Marca | Altera | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | NRND | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $36,50 | $52,80 |
| Series | FLEX 10K | — |
| Family | FLEX 10K (FPGA) | FLEX 10K |
| Usable Gates | 50,000 | — |
| Logic Cells | 2,880 | — |
| Logic Array Blocks (LABs) | 360 | — |
| User I/Os | 189 | — |
| Embedded Array Blocks (EABs) | Yes | 9 |
| Propagation Delay (tpd) | 0.6 ns | — |
| Internal Frequency (max) | 125 MHz | — |
| Supply Voltage (VCCINT) | 5 V | — |
| MultiVolt I/O Interface | Yes (VCCIO can be set independently) | — |
| Logic Family | CMOS | — |
| Process Technology | 0.42 µm | 0.42 µm CMOS |
| Encapsulado | 240-BFQFP Exposed Pad (RQFP) | 240-BFQFP Exposed Pad (RQFP, gull-wing) |
| Recuento de pines | 240 | — |
| Temperatura de funcionamiento | 0 °C to 70 °C (Commercial) | 0°C to +70°C (commercial) |
| Tipo de montaje | Surface Mount | Surface Mount |
| Programming | MAX+PLUS II / Quartus (legacy) | — |
| Estado RoHS | [DATA_NEEDED: RoHS status not confirmed in provided web data] | unknown |
| Logic Elements / Cells | — | 3,744 |
| Total Gates | — | 70,000 (typical) |
| Number of LABs/CLBs | — | 468 |
| Number of Flip-Flops | — | 18,432 |
| Maximum User I/O | — | 189 |
| Number of I/O Banks | — | [DATA_NEEDED: I/O bank count] |
| Tensión de alimentación de funcionamiento | — | 5 V |
| Maximum Internal Frequency | — | 125 MHz |
| Speed Grade | — | -2 |
| Programmability | — | SRAM-based, in-system programmable |
| Configuration Interface | — | Serial configuration EPROM, JTAG (IEEE 1149.1) |