EPF10K50VBI356-4 vs EPF10K50VBI356-3N Comparación
Comparación detallada lado a lado de EPF10K50VBI356-4 por Intel y EPF10K50VBI356-3N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Intel
EPF10K50VBI356-4 - 50K Gates Flex 10K FPGA, 356-BGA | Intel / Altera
EPF10K50VBI356-4 ObsoleteIntel
EPF10K50VBI356-3N - 50K Gates, 356-BGA FLEX 10K FPGA | Altera
EPF10K50VBI356-3N ⚠ Última compraComparación de especificaciones
| Parámetro | EPF10K50VBI356-4 | EPF10K50VBI356-3N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Obsolete | Última compra |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $119,00 | $54,75 |
| Family | FLEX 10K | FLEX 10K |
| Logic Elements / Cells | 2,880 | 2880 |
| Typical Gates | 50,000 | — |
| Usable Gates | 20,480 | — |
| Logic Array Blocks (LABs) | 360 | — |
| Embedded Array Blocks (EABs) | 16 | — |
| Maximum User I/O | 274 | — |
| Internal Frequency | 125 MHz | — |
| Propagation Delay | 0.6 ns | — |
| Process Technology | 0.42 µm CMOS | 0.42 µm CMOS SRAM |
| Core Supply Voltage | 3.3 V | 3.3 V |
| Encapsulado | 356-ball LBGA | — |
| Temperatura de funcionamiento | 0 °C to 70 °C (Commercial) | — |
| Configuration Method | SRAM, in-system via JTAG | — |
| Speed Grade | -4 | -3 (commercial/industrial timing) |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount |
| Series | — | FLEX-10K® |
| Total RAM Bits | — | 20480 |
| Number of LABs/CLBs | — | 360 |
| Number of User I/O | — | 274 |
| Number of Gates (typical) | — | 50000 |
| Operating Temperature (industrial) | — | -40 °C to +85 °C |
| Package Type | — | 356-LBGA (Ball Grid Array, low-profile) |
| In-System Programmable | — | Yes (JTAG IEEE 1149.1) |
| Lead-Free (Pb-Free) | — | Yes (suffix "N") |