EPF10K50VQC240-3 vs EPF10K50VQC240-3N Comparación
Comparación detallada lado a lado de EPF10K50VQC240-3 por Intel y EPF10K50VQC240-3N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EPF10K50VQC240-3 | EPF10K50VQC240-3N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | NRND | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $21,50 | $49,95 |
| Family | FLEX 10K | FLEX 10K |
| Series | EPF10K50 | FLEX 10K |
| Typical Gates | 50,000 | — |
| Logic Elements / Cells | 2,880 | — |
| Logic Array Blocks (LABs) | 360 | — |
| User I/Os | 189 | — |
| Number of I/O Banks | [DATA_NEEDED: number of I/O banks] | — |
| Supply Voltage (VCCINT) | 3.3 V | — |
| Process Technology | 0.42 µm CMOS | — |
| Maximum Internal Frequency | 125 MHz | — |
| Propagation Delay (tpd) | 0.6 ns | — |
| Package Type | 240-pin PQFP (Plastic Quad Flat Pack) | — |
| Package Code | FQFP-240 | — |
| Temperatura de funcionamiento | 0 °C to +70 °C (Commercial) | 0 °C to +70 °C (Commercial) |
| Tipo de montaje | Surface Mount | Surface Mount |
| Configuration Method | SRAM-based, requires external EPC device or MCU | — |
| Speed Grade | -3 (mid-tier) | -3 |
| Estado RoHS | [DATA_NEEDED: RoHS compliance status] | — |
| Logic Cells / Elements | — | 2880 |
| Total RAM Bits | — | 20480 |
| Number of LABs/CLBs | — | 360 |
| Number of User I/Os | — | 189 |
| System Gates | — | 50000 |
| Internal Frequency (max) | — | 125 MHz |
| Propagation Delay | — | 0.6 ns |
| Tensión de alimentación de funcionamiento | — | 3.3 V |
| Technology | — | 0.42 µm CMOS |
| Encapsulado | — | 240-BFQFP / PQFP |
| Compliance / Lead Status | — | Contains lead; verify RoHS applicability per lot |