EPF10K50VRI240-3 vs EPF10K50VRI240-4 Comparación
Comparación detallada lado a lado de EPF10K50VRI240-3 por Intel y EPF10K50VRI240-4 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EPF10K50VRI240-3 | EPF10K50VRI240-4 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Obsolete | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $52,75 | $13,85 |
| Series | FLEX 10K | FLEX 10K |
| Family | FLEX 10K (Altera, now Intel) | Flex® 10K |
| Logic Cells / Elements | 2,880 | — |
| Gates | 50,000 (typical) | — |
| Total RAM Bits | 24,576 (12 EABs x 2 Kbit) | 20480 |
| Number of LABs/CLBs | 360 LABs | — |
| Number of EABs | 12 | — |
| User I/Os | 189 | — |
| Internal Frequency (max) | 125 MHz | — |
| Propagation Delay | 0.5 ns (per datasheet family spec) | 0.6 ns |
| Number of PLLs | 4 | — |
| Core Voltage | 3.3 V | — |
| Process Technology | 0.42 µm CMOS | 0.42 µm CMOS |
| Logic Family | CMOS | — |
| Temperatura de funcionamiento | 0 °C to +70 °C (commercial) | 0°C to 70°C |
| Encapsulado | 240-pin RQFP (Power Quad Flat Pack), exposed pad | — |
| Tipo de montaje | Surface Mount, gull-wing leads | Surface Mount |
| Pin/Package Code | HFQFP / RQFP-240 / PQFP240 | — |
| Configuration Method | Serial (EPC2/EPC8) or JTAG | — |
| Estado RoHS | Non-RoHS (legacy SnPb finish typical) | Non-Compliant |
| Number of Logic Elements / Cells | — | 2880 |
| Number of LABs / CLBs | — | 360 |
| Typical Gates | — | 50000 |
| Maximum System Gates | — | 50000 |
| Number of I/O | — | 189 |
| Voltage - Supply | — | 3.3 V |
| Encapsulado / Carcasa | — | 240-RQFP Exposed Pad |
| Supplier Device Package | — | 240-BFQFP Exposed Pad |
| Speed Grade | — | -4 |