EPF10K70RC240-2N vs EPF10K70RC240-2 Comparación
Comparación detallada lado a lado de EPF10K70RC240-2N por Intel y EPF10K70RC240-2 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EPF10K70RC240-2N | EPF10K70RC240-2 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Obsolete | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $65,00 | $52,80 |
| Series | FLEX 10K | — |
| Logic Elements / Cells | 3,744 | 3,744 |
| Total Gates | 70,000 (typical) | 70,000 (typical) |
| System Gates | 118,000 | — |
| Number of LABs | 468 | — |
| Embedded Memory (bits) | 18,432 | — |
| User I/O Pins | 189 | — |
| Tensión de alimentación | 5 V | — |
| Logic Family | CMOS | — |
| Process Technology | 0.42 µm | 0.42 µm CMOS |
| Maximum Operating Frequency | 125 MHz | — |
| Propagation Delay | 0.4 ns | — |
| Package Type | 240-RQFP (BFQFP with exposed pad) | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Temperatura de funcionamiento | 0 °C to 70 °C (Commercial) | 0°C to +70°C (commercial) |
| Configuration Technology | SRAM-based (volatile, requires external config ROM) | — |
| Programming Interface | JTAG / passive serial | — |
| Estado RoHS | [DATA_NEEDED: RoHS compliance flag] | unknown |
| Family | — | FLEX 10K |
| Number of LABs/CLBs | — | 468 |
| Number of Flip-Flops | — | 18,432 |
| Embedded Array Blocks (EABs) | — | 9 |
| Maximum User I/O | — | 189 |
| Number of I/O Banks | — | [DATA_NEEDED: I/O bank count] |
| Tensión de alimentación de funcionamiento | — | 5 V |
| Maximum Internal Frequency | — | 125 MHz |
| Speed Grade | — | -2 |
| Encapsulado | — | 240-BFQFP Exposed Pad (RQFP, gull-wing) |
| Programmability | — | SRAM-based, in-system programmable |
| Configuration Interface | — | Serial configuration EPROM, JTAG (IEEE 1149.1) |