EPF8820ATC144-3N vs EPF8820ATC144-3 Comparación
Comparación detallada lado a lado de EPF8820ATC144-3N por Intel y EPF8820ATC144-3 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EPF8820ATC144-3N | EPF8820ATC144-3 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | NRND | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $10,40 | $9,25 |
| Family | FLEX 8000 | FLEX 8000 |
| Logic Cells | 672 | — |
| Usable Gates | 8,000 (typical) | 16,000 |
| Logic Array Blocks (LABs) | 84 | — |
| User I/Os | 112 to 152 (per package) | — |
| Process Technology | 0.42 µm CMOS SRAM | — |
| Tensión de alimentación | 4.75 V to 5.25 V (5 V nominal) | — |
| Speed Grade | -3 | -3 |
| Temperatura de funcionamiento | 0 °C to +70 °C (Commercial) | 0 C to +70 C (commercial) |
| Encapsulado | 144-pin TQFP / LFQFP (20 x 20 mm) | 144-LQFP (also referred to as 144-TQFP, 20x20 mm) |
| Configuration Method | SRAM, external EPROM or EPC-series device | — |
| In-Circuit Reconfigurable | Yes | — |
| Tipo de montaje | Surface Mount (Gull-Wing) | Surface Mount |
| Estado RoHS | [DATA_NEEDED: RoHS compliance status] | unknown |
| Lead-Free | [DATA_NEEDED: lead-free status] | — |
| Nivel MSL | [DATA_NEEDED: MSL moisture sensitivity level] | — |
| Series | — | FLEX 8000 |
| Logic Elements (LE) | — | 672 |
| Logic Array Blocks (LAB) | — | 84 |
| Number of Registers | — | up to 1,500 |
| Maximum User I/O | — | 112 (per Mouser; DigiKey lists 152 for BGA variant) |
| Supply Voltage VCCINT | — | 4.75 V to 5.25 V (5.0 V nominal) |
| I/O Supply Voltage VCCIO | — | 3.3 V or 5.0 V selectable |
| Logic Family | — | CMOS |
| Configuration Memory | — | SRAM (volatile, requires external configuration device) |