EPM240GT100C3 vs EPM240T100C3 Comparación
Comparación detallada lado a lado de EPM240GT100C3 por Intel y EPM240T100C3 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EPM240GT100C3 | EPM240T100C3 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $9,95 | $3,45 |
| Family | MAX II | — |
| Logic Elements (LE) | 240 | — |
| Equivalent Macro Cells | 192 | — |
| Pin-to-Pin Delay (tPD) | 4.7 ns | — |
| Maximum Internal Frequency (fMAX) | 304 MHz | — |
| User I/O Count | 80 | — |
| User Flash Memory (UFM) | 8 Kbit | — |
| Process Technology | 0.18 µm 6-layer-metal flash | — |
| Core Supply Voltage | 1.8 V (internal) | — |
| I/O Bank Voltages (MultiVolt) | 1.5 V / 1.8 V / 2.5 V / 3.3 V | — |
| Programming Interface | IEEE 1149.1 JTAG (ISP) | — |
| Encapsulado | TQFP-100 (100-TQFP, 16 × 16 mm, 0.5 mm pitch) | — |
| Temperatura de funcionamiento | 0 °C to 85 °C (commercial, C3 suffix) | 0C to +85C (commercial) |
| Tipo de montaje | Surface Mount | Surface Mount |
| Nivel MSL | 3 (168 hours) | [DATA_NEEDED: MSL rating] |
| Series | — | MAX II |
| Device Family | — | EPM240 (MAX II G) |
| Logic Elements | — | 240 |
| Macrocells | — | 192 |
| User I/Os | — | 80 |
| User Flash Memory | — | 8 Kbit (approx., non-volatile) |
| Internal Supply Voltage | — | 2.5 V or 3.3 V |
| I/O Standards Supported | — | 1.5 V, 1.8 V, 2.5 V, 3.3 V (MultiVolt) |
| Programmable Type | — | In-System Programmable (ISP) via JTAG |
| Propagation Delay | — | [DATA_NEEDED: tPD specification] |
| Encapsulado / Carcasa | — | 100-TQFP (14x14 mm) |
| Supplier Device Package | — | TQFP-100 |
| Estado RoHS | — | Compliant (per distributor listings) |