EPM240M100C4N vs EPM240M100C5N Comparación
Comparación detallada lado a lado de EPM240M100C4N por Intel y EPM240M100C5N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EPM240M100C4N | EPM240M100C5N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Última compra |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $7,45 | $4,25 |
| Series | MAX II | — |
| Device Family | EPM240 | — |
| Macro Cells | 192 | — |
| User I/Os | 80 | 80 |
| Propagation Delay (tPD) Max | 4.7 ns | — |
| Internal Operating Frequency | 247.5 MHz | — |
| Supply Voltage - Core | 2.5 V / 3.3 V | 1.8 V |
| I/O Standards Supported | 1.5 V, 1.8 V, 2.5 V, 3.3 V LVCMOS/LVTTL | — |
| User Flash Memory | 8 Kbit | 8 Kbits |
| Programmability | In-System Programmable via JTAG (IEEE 1149.1) | — |
| Configuration Memory | Non-volatile on-chip flash (instant-on) | On-chip Flash (non-volatile) |
| Logic Family | CMOS | CMOS |
| Encapsulado | 100-pin Micro FineLine BGA (MBGA), 6 x 6 mm, 0.5 mm pitch | 100-ball MBGA (Micro FBGA), 6 x 6 mm, 0.5 mm pitch |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount |
| Temperatura de funcionamiento | -40 C to +125 C (industrial) | -40 C to +125 C |
| Estado RoHS | Lead Free (per DigiChip spec sheet) | Compliant (lead-free) |
| Logic Array Blocks (LABs) | 4 (16 macrocells per LAB) | — |
| MultiTrack Interconnect | Yes | — |
| Hot Socketing | Yes | — |
| Family | — | MAX II |
| Logic Elements | — | 240 |
| Macrocells | — | 192 |
| Propagation Delay (tPD) | — | 4.7 ns |
| Supply Voltage - I/O | — | 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| Process Technology | — | 0.18 µm CMOS |
| JTAG Support | — | IEEE 1149.1 boundary-scan |