EPM240T100C3 vs EPM240T100C4 Comparación
Comparación detallada lado a lado de EPM240T100C3 por Intel y EPM240T100C4 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EPM240T100C3 | EPM240T100C4 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $3,45 | $8,20 |
| Series | MAX II | MAX II |
| Device Family | EPM240 (MAX II G) | — |
| Logic Elements | 240 | — |
| Macrocells | 192 | — |
| User I/Os | 80 | — |
| User Flash Memory | 8 Kbit (approx., non-volatile) | 8 Kbits (typical) |
| Internal Supply Voltage | 2.5 V or 3.3 V | 2.5 V / 3.3 V |
| I/O Standards Supported | 1.5 V, 1.8 V, 2.5 V, 3.3 V (MultiVolt) | — |
| Programmable Type | In-System Programmable (ISP) via JTAG | In System Programmable |
| Propagation Delay | [DATA_NEEDED: tPD specification] | — |
| Encapsulado / Carcasa | 100-TQFP (14x14 mm) | 100-pin TQFP |
| Supplier Device Package | TQFP-100 | 100-TQFP (16 × 16 mm, 0.5 mm pitch) |
| Temperatura de funcionamiento | 0C to +85C (commercial) | 0 °C to +85 °C (TJ, commercial) |
| Tipo de montaje | Surface Mount | Surface Mount |
| Nivel MSL | [DATA_NEEDED: MSL rating] | [DATA_NEEDED: MSL level] |
| Estado RoHS | Compliant (per distributor listings) | [DATA_NEEDED: RoHS status] |
| Number of Macrocells | — | 192 |
| Number of Logic Elements/Blocks | — | 240 |
| Number of User I/O | — | 80 |
| Maximum Propagation Delay (tPD) | — | 4.7 ns |
| I/O Bank Voltage (VCCIO) | — | 1.5 V / 1.8 V / 2.5 V / 3.3 V (MultiVolt) |
| Process Technology | — | 0.18 µm CMOS, non-volatile Flash |
| Programming Interface | — | JTAG (IEEE 1149.1) - ISP |