EPM240ZM100I8N vs EPM240ZM100C6N Comparación
Comparación detallada lado a lado de EPM240ZM100I8N por Intel y EPM240ZM100C6N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EPM240ZM100I8N | EPM240ZM100C6N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $8,45 | $7,10 |
| Series | MAX II | — |
| Device Family | EPM240Z (Zero-Power MAX II) | — |
| Macro Cells | 192 | 192 |
| User I/Os (Max) | 80 | — |
| Logic Elements | 240 | 240 |
| Propagation Delay (tPD) | 7.5 ns | 7.5 ns |
| Internal Performance Frequency | 118.3 MHz | — |
| Process Technology | 0.18 µm CMOS | 0.18 µm 6-layer-metal flash |
| Core Supply Voltage (VCCINT) | 1.8 V | — |
| I/O Supply Voltage (VCCIO) | 1.5 V / 1.8 V / 2.5 V / 3.3 V | — |
| User Flash Memory (UFM) | 8 Kbits | 8 Kbits |
| Encapsulado | 100-ball Micro FBGA (MBGA), 6x6 mm, 0.5 mm pitch | 100-MBGA (Micro FineLine BGA), 6 × 6 mm, 0.5 mm pitch |
| Temperatura de funcionamiento | -40C to +100C (Industrial) | -40 °C to +125 °C |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount (BGA) |
| Estado RoHS | Lead-Free per datasheet | — |
| Configuration Memory | On-chip Flash (non-volatile, instant-on) | — |
| Programming Interface | JTAG (IEEE Std. 1149.1) - ISP | — |
| Family | — | MAX II |
| User I/Os | — | 80 |
| Max Internal Frequency | — | 184.1 MHz |
| Global Clocks | — | 4 |
| Core Supply Voltage | — | 1.8 V |
| I/O Supply Voltages (MultiVolt) | — | 1.5 V / 1.8 V / 2.5 V / 3.3 V / 5.0 V |
| Standby Current | — | 25 µA typical |
| Programming | — | JTAG ISP (in-system programmable) |
| Lead Free | — | Yes |