EPM3512AFC256-22 vs EPM3512AFC256-2N Comparación
Comparación detallada lado a lado de EPM3512AFC256-22 por Intel y EPM3512AFC256-2N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EPM3512AFC256-22 | EPM3512AFC256-2N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Obsolete | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $16,10 | $25,80 |
| Family | MAX 3000A | MAX 3000A |
| Device Type | CPLD (Complex Programmable Logic Device) | — |
| Macrocells | 512 | 512 |
| Logic Array Blocks (LABs) | 16 | 32 |
| Maximum User I/O Pins | 208 (typical for FC256 package) | 212 |
| Speed Grade | -22 (tPD ~22 ns) | — |
| Propagation Delay (tPD) | 22 ns | [DATA_NEEDED: tPD in ns] |
| Supply Voltage VCCINT | 3.3 V | — |
| I/O Standards Supported | 2.5 V, 3.3 V, 5.0 V (VCCIO selectable) | — |
| In-System Programming | IEEE Std. 1532-compliant ISP via JTAG | — |
| Configuration Memory | On-chip EEPROM (non-volatile) | Non-volatile EEPROM |
| Encapsulado | FC-256 (FineLine BGA, 256 balls, 1.0 mm pitch) | 256-ball FineLine BGA (FC-256) |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount (BGA) |
| Temperatura de funcionamiento | [DATA_NEEDED: operating temperature grade] | — |
| Estado RoHS | [DATA_NEEDED: RoHS compliance status] | Compliant |
| Maximum Operating Frequency | — | [DATA_NEEDED: fMAX in MHz] |
| Process Technology | — | 0.30 µm CMOS EEPROM |
| In-System Programmability | — | IEEE Std. 1532 JTAG |
| VCCINT (Core Supply) | — | 3.3 V |
| VCCIO (I/O Supply) | — | 2.5 V / 3.3 V / 5.0 V MultiVolt |
| PCI Compliance | — | 3.3 V PCI-compliant |
| Operating Temperature (Commercial) | — | 0 °C to +70 °C |
| Lead-Free | — | Yes |