EPM3512AFC256-2N vs EPM3512AFC256-3N Comparación
Comparación detallada lado a lado de EPM3512AFC256-2N por Intel y EPM3512AFC256-3N por Altera. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EPM3512AFC256-2N | EPM3512AFC256-3N |
|---|---|---|
| Marca | Intel | Altera |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Obsolete | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $25,80 | $23,40 |
| Family | MAX 3000A | MAX 3000A |
| Macrocells | 512 | 512 |
| Logic Array Blocks (LABs) | 32 | 16 |
| Maximum User I/O Pins | 212 | — |
| Propagation Delay (tPD) | [DATA_NEEDED: tPD in ns] | — |
| Maximum Operating Frequency | [DATA_NEEDED: fMAX in MHz] | 116.3 MHz |
| Process Technology | 0.30 µm CMOS EEPROM | — |
| Configuration Memory | Non-volatile EEPROM | Non-volatile EEPROM |
| In-System Programmability | IEEE Std. 1532 JTAG | — |
| VCCINT (Core Supply) | 3.3 V | — |
| VCCIO (I/O Supply) | 2.5 V / 3.3 V / 5.0 V MultiVolt | — |
| PCI Compliance | 3.3 V PCI-compliant | — |
| Encapsulado | 256-ball FineLine BGA (FC-256) | 256-ball FineLine BGA (FC-256) |
| Operating Temperature (Commercial) | 0 °C to +70 °C | — |
| Estado RoHS | Compliant | [DATA_NEEDED: RoHS compliance status] |
| Lead-Free | Yes | — |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount |
| Device Type | — | CPLD (Complex Programmable Logic Device) |
| Usable Gates | — | 10,000 |
| Pin-to-Pin Delay (tPD) | — | 3.5 ns (speed grade -3) |
| Speed Grade | — | -3 (slowest in family) |
| Core Supply Voltage (VCCINT) | — | 3.3 V |
| I/O Supply Voltage (VCCIO) | — | 2.5 V / 3.3 V / 5.0 V (MultiVolt) |
| Programming Interface | — | JTAG (IEEE 1149.1) / IEEE Std. 1532 ISP |
| Temperatura de funcionamiento | — | [DATA_NEEDED: operating temperature grade] |