EPM5032DC-25 vs EPM5032DM Comparación

Comparación detallada lado a lado de EPM5032DC-25 por Altera y EPM5032DM por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.

Comparación de especificaciones

Parámetro EPM5032DC-25 EPM5032DM
Marca Altera Intel
Categoría FPGA & CPLD FPGA & CPLD
Estado del ciclo de vida NRND Obsolete
Estado del stock In Stock In Stock
Precio unitario (USD) $3,55 $15,90
Manufacturer Altera (Intel Programmable Solutions Group) —
Product Family MAX 5000 —
Device Type UV Erasable Programmable Logic Device (EPLD) —
Macrocells 32 32
Pin-to-Pin Propagation Delay (tPD) 25 ns —
Maximum Counter Frequency (fCNT) [DATA_NEEDED: maximum counter frequency] —
Setup Time (tSU) [DATA_NEEDED: setup time] —
Number of Dedicated Inputs 32 (in DIP-28 pinout) —
Number of I/O Pins 22 (in DIP-28 pinout, 4 used as dedicated inputs) —
Encapsulado CDIP-28 (Windowed Ceramic DIP-28) CDIP-28 (ceramic windowed DIP, 28-pin)
Process Technology CMOS, EPROM (UV-Erasable) CMOS EEPROM
Architecture PAL-Type, Single-LAB, 32-Macrocell —
Output Structure Programmable I/O with output enable —
Flip-Flop Configuration D, T, JK, or SR (programmable) —
Temperatura de funcionamiento [DATA_NEEDED: operating temperature range] -55C to +125C (military/extended, ceramic package)
Estado RoHS Lead Free / RoHS Compliant (per distributor listings) Non-compliant (ceramic DIP with UV window)
Programming Method UV erase + Altera/Intel MAX+PLUS II programmer —
Erasure Method UV light through ceramic window —
Device Family — MAX 5000
Propagation Delay (tPD) — 25 ns
Usable Gates — 600 to 1000 (typical)
Logic Inputs — 32
Supply Voltage (VCC) — 5 V (typical)
Standby Current — [DATA_NEEDED: ICC standby current]
Programming Technology — UV-erasable (windowed) EEPROM
Logic Function — Combinational and registered (synchronous)
Output Polarity — Programmable
Program Retention — Non-volatile (EEPROM)
Tipo de montaje — Through-hole (DIP)
Lead-Free — No (ceramic DIP contains lead)

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