EPM570FGF256I5N vs EPM570F256C4N Comparación
Comparación detallada lado a lado de EPM570FGF256I5N por Intel y EPM570F256C4N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EPM570FGF256I5N | EPM570F256C4N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $19,80 | $26,85 |
| Family | MAX II | — |
| Device Type | CPLD (Complex Programmable Logic Device) | — |
| Logic Elements (LEs) | 570 | — |
| Macrocells | 440 | 440 |
| Propagation Delay (tPD) | 5.0 ns | — |
| User I/O Pins (max) | 212 | — |
| Encapsulado | 256-ball FBGA (FGF256) | 256-ball FineLine BGA (FBGA) |
| Process Technology | 0.18 micron | 0.18 µm 6-layer-metal flash |
| Configuration Memory | Internal Flash (non-volatile, instant-on) | — |
| Programming Interface | JTAG / ISP | — |
| Tensión de alimentación | 3.3 V core / multi-volt I/O (1.5/1.8/2.5/3.3 V) | — |
| Temperature Grade | Industrial (-40C to +100C) | — |
| Speed Grade | 5 (fast) | — |
| Temperatura de funcionamiento | -40C to +100C | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Nivel MSL | [DATA_NEEDED: MSL level] | — |
| Estado RoHS | Compliant | Compliant |
| Series | — | MAX II |
| Logic Elements | — | 570 LE |
| Logic Array Blocks (LABs) | — | 57 |
| User I/O Count | — | 160 |
| User Flash Memory (UFM) | — | 8 Kbit |
| Package Size | — | 17 mm × 17 mm |
| Maximum Internal Frequency | — | 304 MHz |
| Pin-to-Pin Logic Delay | — | 5.4 ns |
| Operating Supply Voltage (VCCINT) | — | 2.5 V, 3.3 V |
| MultiVolt I/O Voltages | — | 1.5 V, 1.8 V, 2.5 V, 3.3 V |
| Rango de temperatura de funcionamiento | — | 0 °C to +70 °C (commercial) |
| In-System Programmability (ISP) | — | Yes (JTAG) |