EPM570GM256I5N vs EPM570M256I5N Comparación
Comparación detallada lado a lado de EPM570GM256I5N por Intel y EPM570M256I5N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EPM570GM256I5N | EPM570M256I5N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $21,40 | $24,66 |
| Device Family | MAX II | — |
| Series | MAX II G | — |
| Logic Elements (LE) | 570 | — |
| Macrocells | 440 | — |
| User I/Os | 160 | — |
| Propagation Delay (tpd) | 5.4 ns (max) | — |
| Internal Supply Voltage | 1.71 V to 1.89 V | — |
| User Flash Memory (UFM) | 8 Kbits | 8 Kbits |
| Programmable Type | In-System Programmable (ISP) | — |
| Temperatura de funcionamiento | -40 C to +100 C (TJ, industrial) | — |
| Package Type | 256-TFBGA (MBGA), 11x11 mm | 256-MBGA (Micro FineLine BGA, 11x11 mm) |
| Tipo de montaje | Surface Mount | Surface Mount |
| Lead-Free / RoHS | Yes (lead-free, RoHS compliant) | — |
| JTAG / Boundary Scan | IEEE 1149.1 compliant | — |
| Process Technology | 6-layer-metal flash CMOS | 0.18 µm CMOS |
| Family | — | MAX II |
| Macro Cells | — | 440 |
| Logic Elements | — | 570 |
| Number of User I/Os | — | 160 |
| Propagation Delay (tPD) | — | 5.4 ns |
| Maximum Frequency (fMAX) | — | 201.1 MHz |
| Operating Temperature (TJ) | — | -40C to +100C (industrial) |
| Operating Temperature (ambient) | — | -40C to +85C |
| Supply Voltage - Core | — | 2.5 V / 3.3 V internal |
| Supply Voltage - I/O | — | 1.5 V, 1.8 V, 2.5 V, 3.3 V (multi-voltage I/O bank) |
| Nivel MSL | — | 3 |
| Lead Status | — | Lead Free |
| Programmability | — | In-System Programmable (JTAG/ISP) |
| Estado RoHS | — | Compliant |