EPM570T144C3 vs EPM570T144C4N Comparación
Comparación detallada lado a lado de EPM570T144C3 por Intel y EPM570T144C4N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EPM570T144C3 | EPM570T144C4N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $27,40 | $25,10 |
| Family | MAX II | MAX II |
| Device | EPM570 | — |
| Logic Elements (LEs) | 440 | — |
| Macro Cells | 440 | — |
| Maximum User I/O Pins | 160 | 212 (package-dependent; TQFP-144 user count varies) |
| User Flash Memory | 4.0 Kbits | — |
| Logic Array Blocks (LABs) | 8 | — |
| Speed Grade | C3 (5.4 ns tPD1) | — |
| Process Technology | 0.18 µm | 0.18 µm flash CMOS, 6-layer metal |
| Core Voltage (VCCINT) | 3.3 V (internal regulator generates 2.5 V core) | — |
| I/O Voltage (VCCIO) | 1.5 V / 1.8 V / 2.5 V / 3.3 V (MultiVolt I/O) | — |
| Maximum Frequency (internal) | 304 MHz | — |
| Propagation Delay (tPD1) | 5.4 ns | — |
| Encapsulado | 144-pin TQFP (20 mm × 20 mm × 1.4 mm) | TQFP-144 (22 × 22 mm, 0.5 mm pitch) |
| Operating Temperature (Commercial) | 0 °C to +85 °C | — |
| Programming Interface | IEEE 1149.1 JTAG (ISP) | JTAG (IEEE 1149.1) with in-system programmability (ISP) |
| Configuration | Non-volatile, instant-on (single-chip) | — |
| Estado RoHS | [DATA_NEEDED: rohs status] | — |
| Logic Elements (LE) | — | 570 |
| Equivalent Macrocells | — | 440 |
| User Flash Memory (UFM) | — | 8 Kbits |
| Maximum Internal Frequency (fMAX) | — | 247.5 MHz |
| Pin-to-Pin Propagation Delay (tPD) | — | 5.4 ns (C4 speed grade) |
| Core Supply Voltage (VCCINT) | — | 2.5 V / 3.3 V (MultiVolt core) |
| I/O Supply Voltage (VCCIO) | — | 1.5 V / 1.8 V / 2.5 V / 3.3 V (MultiVolt I/O) |
| Temperatura de funcionamiento | — | -40 °C to +85 °C (industrial, suffix N) |
| Tipo de montaje | — | Surface Mount |
| Nivel MSL | — | 3 (per JEDEC J-STD-020) |
| Lead-Free / RoHS | — | Lead-free, RoHS compliant |
| Global Clock Networks | — | 4 |
| Non-Volatile Configuration | — | Yes (instant-on, no external boot PROM required) |