EPM570T144C5 vs EPM570T144C5N Comparación
Comparación detallada lado a lado de EPM570T144C5 por Intel y EPM570T144C5N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EPM570T144C5 | EPM570T144C5N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $17,30 | $9,35 |
| Family | MAX II | MAX II |
| Device Type | CPLD (Complex Programmable Logic Device) | — |
| Macro Cells | 440 | — |
| Pin-to-Pin Delay (tPD) | 5.4 ns | — |
| Maximum Internal Frequency | 201.1 MHz | — |
| User I/Os | 116 | 116 |
| Total Package Pins | 144 | — |
| Encapsulado / Carcasa | 144-TQFP (TQFP-144) | — |
| Core Supply Voltage (VCCINT) | [DATA_NEEDED: VCCINT nominal voltage] | — |
| I/O Supply Voltage (VCCIO) | 2.5 V / 3.3 V (multi-voltage I/O supported) | — |
| Configuration Memory | On-chip flash (non-volatile, instant-on) | — |
| Programming Interface | JTAG (IEEE 1149.1), ISP | IEEE 1149.1 JTAG (in-system programmable) |
| Process Technology | 0.18 µm CMOS | 0.18 µm 6-layer-metal flash |
| Temperatura de funcionamiento | Commercial (0 °C to +85 °C) | 0 °C to +85 °C (commercial, C5 grade) |
| Tipo de montaje | Surface Mount | Surface Mount |
| Estado RoHS | Compliant | Compliant |
| Series | — | MAX II Device |
| Logic Elements (LEs) | — | 570 |
| Macrocells | — | 440 |
| Internal User Flash Memory | — | 8 Kbit |
| Global Clocks | — | 4 |
| Core Voltage (VCCINT) | — | 1.8 V (typical, internally regulated) |
| I/O Voltage (VCCIO) | — | 1.5 V / 1.8 V / 2.5 V / 3.3 V (multi-voltage, per bank) |
| Maximum User I/O Pins | — | 116 |
| Propagation Delay (tPD) | — | 5.5 ns (typical, [DATA_NEEDED: exact speed grade]) |
| Maximum Frequency (fMAX) | — | 201.1 MHz |
| Encapsulado | — | TQFP-144 (20 × 20 mm, 0.5 mm pitch) |
| Configuration Storage | — | On-chip non-volatile flash |
| Supported I/O Standards | — | LVCMOS, LVTTL, PCI, LVDS, SSTL (per bank VCCIO) |
| Lead-Free | — | Yes |
| Nivel MSL | — | 3 (per JEDEC J-STD-020) |
| Design Software | — | Intel Quartus II (MAX II device support) |