H5AN8G8NAFR-RDC vs H5AN8G8NAFR-UHCR Comparación
Comparación detallada lado a lado de H5AN8G8NAFR-RDC por SK hynix y H5AN8G8NAFR-UHCR por SK hynix. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | H5AN8G8NAFR-RDC | H5AN8G8NAFR-UHCR |
|---|---|---|
| Marca | SK hynix | SK hynix |
| Categoría | Memory ICs | Memory ICs |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $2,95 | $2,20 |
| Tipo de memoria | DDR4 SDRAM | DDR4 SDRAM |
| Density | 8 Gbit | 8 Gbit |
| Organización de memoria | 1G x 8 (x8) | 1G x 8 |
| Interfaz | DDR4 (Double Data Rate 4) | CMOS, synchronous DDR4 |
| Speed Grade | -RDC (DDR4-2666 class) | — |
| Velocidad de datos | 2666 MT/s (per -R speed grade suffix) | 2400 Mbps/pin (PC2400) |
| Core Supply Voltage (VDD) | 1.2 V | — |
| I/O Supply Voltage (VDDQ) | 1.2 V | — |
| Wordline Supply (VPP) | 2.5 V | — |
| Banks / Bank Groups | 16 banks / 4 bank groups (DDR4 8Gb architecture) | — |
| Burst Length | 8 (BL8) | — |
| Latencia CAS | [DATA_NEEDED: CAS Latency] | [DATA_NEEDED: CAS latency (CL)] |
| Encapsulado | 78-ball FBGA | FBGA-78 (PBGA78) |
| Tipo de montaje | Surface Mount | Surface Mount |
| Temperatura de funcionamiento | [DATA_NEEDED: Operating Temperature range] | [DATA_NEEDED: operating temperature range] |
| Lead-Free | Yes | — |
| Sin halógenos | Yes | — |
| Estado RoHS | Compliant | Compliant (Lead-Free & Halogen-Free) |
| Datasheet Revision | Rev. 1.2 / Jul. 2017 | — |
| Supply Voltage (VDD) | — | 1.2 V |
| Packing Suffix | — | R = Tape & Reel |
| Speed Grade Code | — | -UH |
| Generation Family | — | H5AN8GxNAFR-xxC (DDR4) |
| Application Class | — | Main memory / high bandwidth |
| Refresh Rate | — | [DATA_NEEDED: refresh specification] |
| Nivel MSL | — | [DATA_NEEDED: moisture sensitivity level] |