H5ANAG8NBJR-PBC vs H5ANAG8NCR-PBC Comparación
Comparación detallada lado a lado de H5ANAG8NBJR-PBC por SK hynix y H5ANAG8NCR-PBC por SK hynix. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | H5ANAG8NBJR-PBC | H5ANAG8NCR-PBC |
|---|---|---|
| Marca | SK hynix | SK hynix |
| Categoría | DRAM | DRAM |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $31,50 | $9,50 |
| Tipo de memoria | DDR4 SDRAM | DDR4 SDRAM |
| Density | 16 Gbit (2 GB) | — |
| Organización de memoria | x8 | x8 |
| Supply Voltage (VDD) | 1.2 V | — |
| Speed Grade / Data Rate | PBC suffix, DDR4-2666 class | — |
| Encapsulado | FBGA-78 (7.5 mm x 11 mm) | FBGA-78 (approximately 7.5 x 11 mm) |
| Tipo de montaje | Surface Mount | Surface Mount |
| Bank Architecture | 16 banks in 4 bank groups (DDR4 standard) | — |
| Prefetch | 8n | — |
| Tipo de interfaz | Parallel, SSTL12 | Parallel, DDR4 (Double Data Rate 4) |
| Temperatura de funcionamiento | [DATA_NEEDED: operating temperature range] | [DATA_NEEDED: operating temperature range] |
| CAS Latency (typical bin) | [DATA_NEEDED: CAS latency] | — |
| Refresh | Self refresh, 1x/2x/4x refresh modes | — |
| Die Revision | BJR | — |
| Estado RoHS | Compliant (Lead-Free & Halogen-Free per Hynix family datasheet) | Compliant (Lead-Free & Halogen-Free per SK hynix family datasheet) |
| Nivel MSL | [DATA_NEEDED: moisture sensitivity level] | — |
| Standard Package Quantity | [DATA_NEEDED: standard quantity] | — |
| Memory Density | — | 16Gb (2 GB) |
| Tensión de alimentación | — | 1.2 V (typical, DDR4 class) |
| Speed Grade Code | — | -PBC (SK hynix speed/temperature code; exact Mbps bin [DATA_NEEDED: speed bin value]) |
| Clock Frequency | — | [DATA_NEEDED: clock frequency] |
| Latencia CAS | — | [DATA_NEEDED: CAS latency] |
| Bank Group Architecture | — | Yes (DDR4 bank groups) |
| On-Die Termination (ODT) | — | Yes (DDR4 standard feature) |
| Self-Refresh | — | Yes (DDR4 standard feature) |
| Process Technology | — | CMOS |
| Application Class | — | Main memory (server, industrial, networking, PC) |