K9CHGY8S5C-BCK0 vs K9HQGY8S5M Comparación

Comparación detallada lado a lado de K9CHGY8S5C-BCK0 por Samsung Electronics y K9HQGY8S5M por Samsung Electronics. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.

Samsung Electronics
K9CHGY8S5C-BCK0 K9CHGY8S5C-BCK0 - Samsung NAND Flash Memory | Samsung Electronics

K9CHGY8S5C-BCK0 - Samsung NAND Flash Memory | Samsung Electronics

K9CHGY8S5C-BCK0 Unknown
Samsung Electronics
K9HQGY8S5M K9HQGY8S5M - 3D V-NAND Flash, FBGA-316 | Samsung | SSD Storage

K9HQGY8S5M - 3D V-NAND Flash, FBGA-316 | Samsung | SSD Storage

K9HQGY8S5M ✓ Activo

Comparación de especificaciones

Parámetro K9CHGY8S5C-BCK0 K9HQGY8S5M
Marca Samsung Electronics Samsung Electronics
Categoría Memory ICs Memory ICs
Estado del ciclo de vida Unknown Activo
Estado del stock In Stock In Stock
Precio unitario (USD) $0,00 $0,00
Manufacturer Samsung Electronics Samsung Electronics
Product Family K9-series NAND Flash —
Tipo de memoria NAND Flash —
Density [DATA_NEEDED: total density] [DATA_NEEDED: total bit density]
Organización de memoria [DATA_NEEDED: page/block organization] —
Bus Width [DATA_NEEDED: x8 or x16] —
Tensión de alimentación [DATA_NEEDED: VCC range] [DATA_NEEDED: VCC range]
Tipo de interfaz [DATA_NEEDED: asynchronous/toggle DDR] —
Read Cycle Time [DATA_NEEDED: tRC] —
Program Time [DATA_NEEDED: tPROG] —
Block Erase Time [DATA_NEEDED: tBERS] —
Endurance [DATA_NEEDED: program/erase cycles] —
Package Type [DATA_NEEDED: package code and dimensions] 316-ball Fine Pitch BGA (FBGA-316)
Temperatura de funcionamiento [DATA_NEEDED: temperature range] [DATA_NEEDED: operating temperature range]
Tipo de montaje Surface Mount Surface Mount (BGA)
Estado RoHS [DATA_NEEDED: RoHS status] [DATA_NEEDED: RoHS status]
Ordering Code Suffix -BCK0 —
Product Type — 3D V-NAND Flash Memory (stacked, client NAND)
Die Configuration — 4 x K9ADGD8S0A V-NAND dies (per TechInsights package analysis)
NAND Technology — 32-layer pMLC 3D V-NAND (per Samsung 850 Pro 256 GB analysis)
Memory Class — Non-volatile NAND flash
Interfaz — NAND (ONFI/Toggle-style asynchronous interface) - exact timing mode [DATA_NEEDED: interface timing mode]
Page Size — [DATA_NEEDED: page size]
Block Size — [DATA_NEEDED: block size]
Program/Erase Cycles — [DATA_NEEDED: P/E endurance rating]
Nivel MSL — [DATA_NEEDED: moisture sensitivity level]
Original Application — Samsung SSD 850 Pro solid-state drive

Hojas de datos y recursos

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