LFE5UM-85F-6BG554C vs LFE5UM-85F-8BG554C Comparación
Comparación detallada lado a lado de LFE5UM-85F-6BG554C por Lattice Semiconductor y LFE5UM-85F-8BG554C por Lattice Semiconductor. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Lattice Semiconductor
LFE5UM-85F-6BG554C - ECP5-5G FPGA, 84K LUTs, 12 SERDES | Lattice
LFE5UM-85F-6BG554C ✓ ActivoLattice Semiconductor
LFE5UM-85F-8BG554C - ECP5 FPGA 84K LUTs SERDES 554-BGA | Lattice
LFE5UM-85F-8BG554C ✓ ActivoComparación de especificaciones
| Parámetro | LFE5UM-85F-6BG554C | LFE5UM-85F-8BG554C |
|---|---|---|
| Marca | Lattice Semiconductor | Lattice Semiconductor |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $13,10 | $142,00 |
| Family | ECP5-5G (LFE5UM) | LatticeECP5 |
| Logic Elements (LUT4) | 84000 | — |
| Embedded Block RAM | 3744 Kbits | — |
| Distributed RAM | [DATA_NEEDED: distributed RAM Kbits] | [DATA_NEEDED: distributed RAM in Kbits] |
| DSP Slices (18x18 multipliers) | 156 | — |
| User I/O | 259 | — |
| SERDES Channels | 12 | Yes, integrated |
| SERDES Data Rate (max) | 5 Gbps | — |
| Core Voltage | 1.1 V | — |
| Process Node | 40 nm | — |
| Speed Grade | -6 | — |
| Encapsulado | 554-ball caBGA (BG554) | — |
| Package Body Size | 23 x 23 mm | — |
| Operating Temperature Grade | Commercial (C) | — |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount |
| Nivel MSL | [DATA_NEEDED: MSL rating] | 3 |
| Estado RoHS | Compliant | Compliant |
| Configuration Memory | SRAM-based (volatile, requires external boot) | — |
| Series | — | LFE5UM |
| Logic Elements / Cells | — | 84000 |
| Number of LUTs | — | 83600 (83.6K) |
| Embedded Memory (EBR) | — | 3833856 bits (3.83 Mbit, 208 blocks) |
| Number of I/O | — | 259 |
| Supply Voltage - Core | — | 1.1 V |
| Supply Voltage - I/O Banks | — | 1.2 V to 3.3 V |
| Encapsulado / Carcasa | — | 554-FBGA / cABGA-554 |
| Temperatura de funcionamiento | — | 0C to +85C (Commercial) |
| Number of Multipliers (18x18) | — | 156 |
| SERDES Data Rate | — | Up to 3.2 Gbps |
| Process Technology | — | 40 nm CMOS |