M1AFS1500-1FGG256 vs M1AFS1500-FG256I Comparación
Comparación detallada lado a lado de M1AFS1500-1FGG256 por Microchip Technology y M1AFS1500-FG256I por Microchip Technology. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Microchip Technology
M1AFS1500-1FGG256 - Fusion FPGA 1.5M Gates, 119 I/O | Microchip
M1AFS1500-1FGG256 ✓ ActivoMicrochip Technology
M1AFS1500-FG256I - Fusion Mixed-Signal FPGA, 1.5M Gates | Microchip
M1AFS1500-FG256I ✓ ActivoComparación de especificaciones
| Parámetro | M1AFS1500-1FGG256 | M1AFS1500-FG256I |
|---|---|---|
| Marca | Microchip Technology | Microchip Technology |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $172,23 | $341,46 |
| Series | Fusion (M1AFS1500) | — |
| System Gates | 1,500,000 | 1500000 gates |
| Logic Cells | 38,400 | — |
| Embedded Processor | ARM Cortex-M1 | — |
| Frecuencia de reloj máxima | 350 MHz | — |
| Number of I/Os | 119 | — |
| Tensión de alimentación | 1.5 V | — |
| Technology | CMOS, 130 nm | — |
| Configuration Memory | Flash-based (non-volatile) | — |
| Encapsulado / Carcasa | 256-LBGA (FBGA, S-PBGA-B256) | — |
| Ball Pitch | 1.00 mm | — |
| Estilo de montaje | SMD/SMT | — |
| Minimum Operating Temperature | 0 C | — |
| Maximum Operating Temperature | +70 C | — |
| Packaging | Tray | — |
| Speed Grade | -1 | — |
| Estado RoHS | [DATA_NEEDED: RoHS compliance status] | [DATA_NEEDED: RoHS status] |
| Integrated Analog Blocks | Yes (configurable analog conditioning and conversion) | — |
| Integrated Flash Memory Blocks | Yes | — |
| Clock Management | Integrated clock generation and management circuitry | On-chip clock generation and management circuitry |
| Family | — | Fusion Mixed-Signal FPGA (M1 series) |
| User I/O | — | 119 |
| Flash Memory | — | 276480 bits |
| Logic Technology | — | 130 nm flash-based CMOS, 7-layer metal |
| System Performance | — | 350 MHz |
| Core Supply Voltage | — | 1.5 V |
| Encapsulado | — | 256-LBGA (FG256) |
| Tipo de montaje | — | Surface Mount |
| Processor Support | — | ARM Cortex-M1 soft core |
| Security | — | 128-bit flash lock with AES decryption |
| Configuration | — | Nonvolatile flash, Live at Power-Up (LAPU) |
| Temperature Grade | — | I (Industrial), -40C to +85C |
| Analog Features | — | Configurable analog blocks (mixed-signal) |
| Moisture Sensitivity Level | — | [DATA_NEEDED: MSL level] |