M1AFS1500-1FGG256K vs M1AFS1500-1FGG256I Comparación
Comparación detallada lado a lado de M1AFS1500-1FGG256K por Microchip Technology y M1AFS1500-1FGG256I por Microchip Technology. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Microchip Technology
M1AFS1500-1FGG256K - 1.5M Gate Fusion FPGA, ARM Cortex-M1 | Microchip
M1AFS1500-1FGG256K ✓ ActivoMicrochip Technology
M1AFS1500-1FGG256I - 1.5M Gate Fusion FPGA, ARM Cortex-M1 | Microchip
M1AFS1500-1FGG256I ✓ ActivoComparación de especificaciones
| Parámetro | M1AFS1500-1FGG256K | M1AFS1500-1FGG256I |
|---|---|---|
| Marca | Microchip Technology | Microchip Technology |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $0,00 | $136,90 |
| Number of Gates | 1,500,000 system gates | — |
| Number of I/O | 119 | — |
| Total RAM Bits | 276480 | — |
| Embedded Processor | ARM Cortex-M1 | — |
| Tensión de alimentación | 1.425 V to 1.575 V (1.5 V nominal) | — |
| Max Frequency | 1282.05 MHz | — |
| Technology | 130 nm flash-based | — |
| Encapsulado / Carcasa | 256-LBGA (256-FBGA, 17x17 mm) | — |
| Supplier Device Package | 256-FPBGA (17x17) | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Temperatura de funcionamiento | -55C to +100C (TJ) | -40C to +85C (industrial, I suffix) |
| Family | Fusion Mixed-Signal FPGA | Fusion (M1 series, mixed-signal FPGA) |
| Packaging | Tray | — |
| Programmable Type | In-System Programmable (flash-based, non-volatile) | — |
| Estado RoHS | RoHS3 Compliant | [DATA_NEEDED: RoHS status] |
| Lead Free Status | Lead Free | — |
| Manufacturer Lead Time | 16 weeks | — |
| Product Status | Active | — |
| System Gates | — | 1.5 million |
| Processor Core | — | ARM Cortex-M1 (soft core in fabric) |
| User I/O | — | 119 |
| Flash Configuration Memory | — | 276480 bits |
| Logic Cells | — | 38400 |
| Core Supply Voltage | — | 1.5 V |
| Process Technology | — | 130 nm flash-based |
| Encapsulado | — | 256-LBGA (FBGA), 17x17 mm, 1.0 mm ball pitch |
| Speed Grade | — | -1 (standard) |
| Configuration Type | — | Flash-based, instant-on, single chip |
| Security | — | 128-bit flash lock, AES decryption |
| Analog Features | — | Configurable analog blocks (mixed-signal) |
| Clock Management | — | Integrated CCC (clock conditioning circuits) |