M1AFS1500-2FGG256 vs A3P600-2FG256 Comparación
Comparación detallada lado a lado de M1AFS1500-2FGG256 por Microchip Technology y A3P600-2FG256 por Microchip Technology. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Microchip Technology
M1AFS1500-2FGG256 - 1.5M Gate Fusion FPGA with Cortex-M1 | Microchip
M1AFS1500-2FGG256 ✓ ActivoMicrochip Technology
A3P600-2FG256 - ProASIC3 FPGA 600K Gates 256-FBGA | Microchip
A3P600-2FG256 ✓ ActivoComparación de especificaciones
| Parámetro | M1AFS1500-2FGG256 | A3P600-2FG256 |
|---|---|---|
| Marca | Microchip Technology | Microchip Technology |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $124,50 | $57,43 |
| Series | M1AFS1500 (Fusion) | — |
| System Gates | 1,500,000 | 600000 gates |
| Logic Cells | 38,400 | — |
| Embedded Processor | ARM Cortex-M1 | — |
| Frecuencia de reloj máxima | 350 MHz | — |
| Number of I/O | 119 | — |
| Tensión de alimentación de funcionamiento | 1.5 V | — |
| Flash Memory Bits (reported) | 276480 | — |
| Technology | CMOS, 130nm class | — |
| Speed Grade | -2 | -2 |
| Encapsulado / Carcasa | 256-LBGA (FBGA, S-PBGA-B256) | — |
| Ball Pitch | 1.00 mm | — |
| Estilo de montaje | SMD/SMT | — |
| Rango de temperatura de funcionamiento | 0C to +70C | — |
| Analog Blocks | Configurable analog (Fusion mixed-signal architecture) | — |
| Programming Type | Flash-based (in-system programmable) | — |
| Packaging | Tray | — |
| Moisture Sensitivity Level | [DATA_NEEDED: MSL level] | — |
| Total RAM Blocks | [DATA_NEEDED: RAM block count] | — |
| Logic Family | — | ProASIC3 |
| User I/O Count | — | 177 |
| Maximum System Frequency | — | 310 MHz |
| Core Voltage | — | 1.5 V |
| Process Technology | — | 130 nm CMOS flash |
| Configuration Memory | — | On-chip Flash (non-volatile) |
| I/O Banks | — | 4 |
| Encapsulado | — | 256-FBGA (LBGA) |
| Tipo de montaje | — | Surface Mount |
| Soft CPU Support | — | Optional soft ARM |
| Instant-On Operation | — | Yes |
| Temperatura de funcionamiento | — | [DATA_NEEDED: operating temperature range] |
| Embedded Memory | — | [DATA_NEEDED: embedded memory bit count] |
| Estado RoHS | — | [DATA_NEEDED: RoHS status] |
| Programmability | — | Reprogrammable (flash) |