M1AFS1500-FG256I vs M1AFS1500-1FG256I Comparación

Comparación detallada lado a lado de M1AFS1500-FG256I por Microchip Technology y M1AFS1500-1FG256I por Microchip Technology. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.

Microchip Technology
M1AFS1500-FG256I M1AFS1500-FG256I - Fusion Mixed-Signal FPGA, 1.5M Gates | Microchip

M1AFS1500-FG256I - Fusion Mixed-Signal FPGA, 1.5M Gates | Microchip

M1AFS1500-FG256I ✓ Activo
Microchip Technology
M1AFS1500-1FG256I M1AFS1500-1FG256I - Fusion FPGA 1.5M Gates 256-LBGA | Microchip

M1AFS1500-1FG256I - Fusion FPGA 1.5M Gates 256-LBGA | Microchip

M1AFS1500-1FG256I ✓ Activo

Comparación de especificaciones

Parámetro M1AFS1500-FG256I M1AFS1500-1FG256I
Marca Microchip Technology Microchip Technology
Categoría FPGA & CPLD FPGA & CPLD
Estado del ciclo de vida Activo Activo
Estado del stock In Stock In Stock
Precio unitario (USD) $341,46 $205,00
Family Fusion Mixed-Signal FPGA (M1 series) —
System Gates 1500000 gates —
User I/O 119 119
Flash Memory 276480 bits —
Logic Technology 130 nm flash-based CMOS, 7-layer metal —
System Performance 350 MHz up to 350 MHz
Core Supply Voltage 1.5 V 1.5 V
Encapsulado 256-LBGA (FG256) 256-LBGA (FG256)
Tipo de montaje Surface Mount Surface Mount
Processor Support ARM Cortex-M1 soft core —
Security 128-bit flash lock with AES decryption —
Configuration Nonvolatile flash, Live at Power-Up (LAPU) —
Temperature Grade I (Industrial), -40C to +85C —
Analog Features Configurable analog blocks (mixed-signal) —
Clock Management On-chip clock generation and management circuitry Integrated clock generation and management circuitry
Estado RoHS [DATA_NEEDED: RoHS status] Non-Compliant (contains lead, per distributor data)
Moisture Sensitivity Level [DATA_NEEDED: MSL level] —
Logic Capacity — 1,500,000 system gates
Processor Core — ARM Cortex-M1 (M1 variant)
Memory Resource — 276480 bits
Configuration Technology — Flash-based, nonvolatile
Process Technology — 130 nm CMOS, 7-layer metal
Temperatura de funcionamiento — -40C to +85C (industrial grade, suffix I)
Speed Grade — -1 (standard)
Power-Up Behavior — Live at Power-Up (LAPU)
Analog Functionality — Fusion configurable analog blocks
Lead-Free Status — Contains Lead

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