M1AFS1500-FGG256 vs M1AFS1500-1FGG256 Comparación
Comparación detallada lado a lado de M1AFS1500-FGG256 por Microchip Technology y M1AFS1500-1FGG256 por Microchip Technology. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Microchip Technology
M1AFS1500-FGG256 - 1.5M Gate Fusion FPGA, ARM Cortex-M1 | Microchip
M1AFS1500-FGG256 ✓ ActivoMicrochip Technology
M1AFS1500-1FGG256 - Fusion FPGA 1.5M Gates, 119 I/O | Microchip
M1AFS1500-1FGG256 ✓ ActivoComparación de especificaciones
| Parámetro | M1AFS1500-FGG256 | M1AFS1500-1FGG256 |
|---|---|---|
| Marca | Microchip Technology | Microchip Technology |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $172,23 | $172,23 |
| Manufacturer Part Number | M1AFS1500-FGG256 | — |
| Family | Fusion (M1 series with ARM Cortex-M1) | — |
| System Gates | 1500000 | 1,500,000 |
| Logic Cells | 38400 | 38,400 |
| Frecuencia de reloj máxima | 350 MHz | 350 MHz |
| User I/O | 119 | — |
| Flash Memory | 276480 bit | — |
| Embedded Processor | ARM Cortex-M1 | ARM Cortex-M1 |
| Technology | CMOS, flash-based configuration | CMOS, 130 nm |
| Encapsulado | 256-LBGA (S-PBGA-B256) | — |
| Ball Pitch | 1.00 mm | 1.00 mm |
| Terminal Form | Ball | — |
| Package Shape | Square | — |
| Tipo de montaje | Surface Mount | — |
| Temperatura de funcionamiento | [DATA_NEEDED: operating temperature range] | — |
| Tensión de alimentación | [DATA_NEEDED: core/IO supply voltage] | 1.5 V |
| Estado RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS compliance status] |
| Series | — | Fusion (M1AFS1500) |
| Number of I/Os | — | 119 |
| Configuration Memory | — | Flash-based (non-volatile) |
| Encapsulado / Carcasa | — | 256-LBGA (FBGA, S-PBGA-B256) |
| Estilo de montaje | — | SMD/SMT |
| Minimum Operating Temperature | — | 0 C |
| Maximum Operating Temperature | — | +70 C |
| Packaging | — | Tray |
| Speed Grade | — | -1 |
| Integrated Analog Blocks | — | Yes (configurable analog conditioning and conversion) |
| Integrated Flash Memory Blocks | — | Yes |
| Clock Management | — | Integrated clock generation and management circuitry |