M1AFS250-2FG256I vs M1AFS250-FG256 Comparación
Comparación detallada lado a lado de M1AFS250-2FG256I por Microchip Technology y M1AFS250-FG256 por Microchip Technology. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Microchip Technology
M1AFS250-2FG256I - 250K Gate Fusion FPGA, ARM M1 | Microchip
M1AFS250-2FG256I ✓ ActivoMicrochip Technology
M1AFS250-FG256 - Fusion FPGA 250K Gates ARM Cortex-M1 | Microchip
M1AFS250-FG256 ✓ ActivoComparación de especificaciones
| Parámetro | M1AFS250-2FG256I | M1AFS250-FG256 |
|---|---|---|
| Marca | Microchip Technology | Microchip Technology |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $0,00 | $112,00 |
| Family | Fusion (M1AFS, ARM Cortex-M1 support) | Fusion (M1 series, ARM Cortex-M1) |
| System Gates | 250K | 250000 |
| User I/O | 114 | — |
| Embedded RAM Bits | 36864 | — |
| Core Supply Voltage | 1.5 V | 1.5 V |
| Process Technology | 130 nm, 7-layer metal flash-based CMOS | 130 nm |
| System Performance | 350 MHz | — |
| Processor Core | ARM Cortex-M1 (hard IP) | — |
| Configuration Memory | Flash-based, nonvolatile | Flash (nonvolatile) |
| Power-Up Mode | Live at Power-Up (LAPU) | — |
| Analog Block | Configurable analog (voltage, current, temperature monitoring) | — |
| Encapsulado | 256-ball FBGA (256-LBGA) | — |
| Speed Grade | -2 | — |
| Temperature Range | Industrial (-40C to +85C) | — |
| Tipo de montaje | Surface Mount | — |
| Estado RoHS | RoHS Non-Compliant (contains lead; FGG variant is lead-free) | RoHS Non-Compliant (contains lead) |
| Packaging | Tray | Tray |
| Manufacturer Part Number | — | M1AFS250-FG256 |
| Logic Cells | — | 6144 |
| Embedded Processor | — | ARM Cortex-M1 |
| Frecuencia de reloj máxima | — | 350 MHz |
| Number of I/O | — | 114 |
| RAM Bits | — | 36864 |
| Rango de temperatura de funcionamiento | — | 0C to +70C |
| Encapsulado / Carcasa | — | 256-FBGA (256-LBGA), 1.00 mm pitch |
| Estilo de montaje | — | SMD/SMT |
| Lead Free Status | — | Contains Lead |
| Series | — | M1AFS250 |