M1AFS250-2FGG256 vs M7AFS600-FG256 Comparación
Comparación detallada lado a lado de M1AFS250-2FGG256 por Microchip Technology y M7AFS600-FG256 por Microchip Technology. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Microchip Technology
M1AFS250-2FGG256 - Fusion FPGA 250K Gates ARM M1 | Microchip
M1AFS250-2FGG256 ✓ ActivoMicrochip Technology
M7AFS600-FG256 - Fusion FPGA 600K Gates, 119 I/O | Microchip
M7AFS600-FG256 ✓ ActivoComparación de especificaciones
| Parámetro | M1AFS250-2FGG256 | M7AFS600-FG256 |
|---|---|---|
| Marca | Microchip Technology | Microchip Technology |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $83,12 | $198,75 |
| Family | Fusion (M1 series) Mixed-Signal FPGA | — |
| System Gates | 250000 gates | 600000 gates |
| Registers (D-Flip-Flops) | 36864 | — |
| User I/O | 114 | 119 |
| Embedded Processor | ARM Cortex-M1 | ARM CoreMP7 |
| Core Supply Voltage | 1.5 V | 1.5 V |
| Process Technology | 130 nm flash-based | 130 nm Flash |
| Configuration Memory | Flash (in-system programmable, instant-on) | — |
| Analog Features | Configurable analog block, voltage monitoring | — |
| Clock Management | On-chip clock generation and management circuitry | — |
| Encapsulado | 256-LBGA (FGG256) | — |
| Tipo de montaje | Surface Mount | — |
| Temperatura de funcionamiento | [DATA_NEEDED: operating temperature range] | 0 C to +70 C (commercial) |
| Speed Grade | -2 | — |
| Total RAM | [DATA_NEEDED: embedded flash memory capacity] | — |
| Estado RoHS | [DATA_NEEDED: RoHS compliance status] | Compliant |
| Nivel MSL | [DATA_NEEDED: moisture sensitivity level] | — |
| Series | — | M7AFS600 (Fusion) |
| D Flip-Flops / Registers | — | 110592 |
| Configuration Type | — | Flash-based, non-volatile |
| Maximum Operating Frequency | — | 1098.9 MHz (per FPGAkey listing) |
| Encapsulado / Carcasa | — | 256-LBGA (FBGA), 17x17x1.7 mm |
| Terminal Form | — | Ball (SMD/SMT) |
| Estilo de montaje | — | Surface Mount |
| Packaging | — | Tray |
| Product Type | — | Mixed-Signal FPGA |