M1AFS600-2FG256 vs M1AFS1500-FG256I Comparación

Comparación detallada lado a lado de M1AFS600-2FG256 por Microchip Technology y M1AFS1500-FG256I por Microchip Technology. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.

Microchip Technology
M1AFS600-2FG256 M1AFS600-2FG256 - Fusion FPGA 600K Gates ARM Cortex-M1 | Microchip

M1AFS600-2FG256 - Fusion FPGA 600K Gates ARM Cortex-M1 | Microchip

M1AFS600-2FG256 ✓ Activo
Microchip Technology
M1AFS1500-FG256I M1AFS1500-FG256I - Fusion Mixed-Signal FPGA, 1.5M Gates | Microchip

M1AFS1500-FG256I - Fusion Mixed-Signal FPGA, 1.5M Gates | Microchip

M1AFS1500-FG256I ✓ Activo

Comparación de especificaciones

Parámetro M1AFS600-2FG256 M1AFS1500-FG256I
Marca Microchip Technology Microchip Technology
Categoría FPGA & CPLD FPGA & CPLD
Estado del ciclo de vida Activo Activo
Estado del stock In Stock In Stock
Precio unitario (USD) $46,75 $341,46
Series M1AFS600 (Fusion) —
System Gates 600000 gates 1500000 gates
Logic Elements 110592 —
Embedded Processor ARM Cortex-M1 —
Number of I/Os 119 I/O —
Core Supply Voltage 1.5 V 1.5 V
Technology 130 nm flash-based —
Encapsulado / Carcasa 256-LBGA (FBGA-256) —
Estilo de montaje SMD/SMT —
Operating Temperature - Minimum 0 C —
Operating Temperature - Maximum +70 C —
Packaging Tray —
Analog Peripherals Configurable analog block (Fusion mixed-signal) —
On-chip Memory Large flash memory blocks —
Clock Management On-chip clock generation and management (PLL) On-chip clock generation and management circuitry
Configuration Flash-based, live at power-up, no external config PROM required Nonvolatile flash, Live at Power-Up (LAPU)
Estado RoHS [DATA_NEEDED: RoHS status] [DATA_NEEDED: RoHS status]
Maximum Operating Frequency [DATA_NEEDED: maximum fabric operating frequency] —
Family — Fusion Mixed-Signal FPGA (M1 series)
User I/O — 119
Flash Memory — 276480 bits
Logic Technology — 130 nm flash-based CMOS, 7-layer metal
System Performance — 350 MHz
Encapsulado — 256-LBGA (FG256)
Tipo de montaje — Surface Mount
Processor Support — ARM Cortex-M1 soft core
Security — 128-bit flash lock with AES decryption
Temperature Grade — I (Industrial), -40C to +85C
Analog Features — Configurable analog blocks (mixed-signal)
Moisture Sensitivity Level — [DATA_NEEDED: MSL level]

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