M1AFS600-2FG256 vs M7AFS600-FGG256 Comparación
Comparación detallada lado a lado de M1AFS600-2FG256 por Microchip Technology y M7AFS600-FGG256 por Microchip Technology. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Microchip Technology
M1AFS600-2FG256 - Fusion FPGA 600K Gates ARM Cortex-M1 | Microchip
M1AFS600-2FG256 ✓ ActivoMicrochip Technology
M7AFS600-FGG256 - Fusion FPGA 600K Gates 256-BGA | Microchip
M7AFS600-FGG256 ✓ ActivoComparación de especificaciones
| Parámetro | M1AFS600-2FG256 | M7AFS600-FGG256 |
|---|---|---|
| Marca | Microchip Technology | Microchip Technology |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $46,75 | $232,40 |
| Series | M1AFS600 (Fusion) | — |
| System Gates | 600000 gates | 600K |
| Logic Elements | 110592 | — |
| Embedded Processor | ARM Cortex-M1 | ARM CoreMP7 |
| Number of I/Os | 119 I/O | — |
| Core Supply Voltage | 1.5 V | 1.5 V |
| Technology | 130 nm flash-based | — |
| Encapsulado / Carcasa | 256-LBGA (FBGA-256) | — |
| Estilo de montaje | SMD/SMT | — |
| Operating Temperature - Minimum | 0 C | — |
| Operating Temperature - Maximum | +70 C | — |
| Packaging | Tray | Tray |
| Analog Peripherals | Configurable analog block (Fusion mixed-signal) | — |
| On-chip Memory | Large flash memory blocks | — |
| Clock Management | On-chip clock generation and management (PLL) | — |
| Configuration | Flash-based, live at power-up, no external config PROM required | — |
| Estado RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS Status] |
| Maximum Operating Frequency | [DATA_NEEDED: maximum fabric operating frequency] | — |
| Family | — | Fusion (M7AFS600) |
| Flip-Flops | — | 110592 |
| User I/O | — | 119 |
| Process Technology | — | 130 nm flash-based |
| Maximum Frequency | — | 1098.9 MHz (distributor listing) |
| Encapsulado | — | 256-LBGA / 256-FBGA |
| Ball Pitch | — | 1 mm |
| Tipo de montaje | — | Surface Mount |
| Configuration Memory | — | Flash (single-chip, non-volatile) |
| Analog Features | — | Integrated configurable analog blocks, clock generation and management |
| Temperatura de funcionamiento | — | [DATA_NEEDED: Operating Temperature Range] |
| Nivel MSL | — | [DATA_NEEDED: Moisture Sensitivity Level] |