M1AFS600-FGG484I vs M1AFS600-FG484I Comparación

Comparación detallada lado a lado de M1AFS600-FGG484I por Microchip Technology y M1AFS600-FG484I por Microchip Technology. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.

Microchip Technology
M1AFS600-FGG484I M1AFS600-FGG484I - 600K Gate Fusion FPGA, 172 I/O | Microchip

M1AFS600-FGG484I - 600K Gate Fusion FPGA, 172 I/O | Microchip

M1AFS600-FGG484I ✓ Activo
Microchip Technology
M1AFS600-FG484I M1AFS600-FG484I - 600K Gates Fusion FPGA, ARM Cortex-M1 | Microchip

M1AFS600-FG484I - 600K Gates Fusion FPGA, ARM Cortex-M1 | Microchip

M1AFS600-FG484I ✓ Activo

Comparación de especificaciones

Parámetro M1AFS600-FGG484I M1AFS600-FG484I
Marca Microchip Technology Microchip Technology
Categoría FPGA & CPLD FPGA & CPLD
Estado del ciclo de vida Activo Activo
Estado del stock In Stock In Stock
Precio unitario (USD) $128,40 $0,00
Family Fusion (M1 series, ARM Cortex-M1 enabled) —
System Gates 600K —
Logic Elements (flash cells) 110592 —
User I/O 172 —
Core Voltage 1.5 V —
Process Technology 130 nm 130 nm (CMOS flash-based)
Configuration Memory Flash-based (on-chip) —
Processor Support ARM Cortex-M1 —
Security 128-bit FlashLock with AES decryption 128-bit flash lock, AES decryption
Analog Features Configurable analog blocks (mixed-signal) —
Encapsulado 484-ball FBGA (FGG484) —
Tipo de montaje Surface Mount —
Temperature Grade Industrial (I) —
Temperatura de funcionamiento -40C to +85C —
Estado RoHS RoHS Compliant Non-Compliant (contains lead, FG variant)
Lead Free Status Lead Free Contains Lead
Packaging Tray Tray
Max Frequency [DATA_NEEDED: maximum fabric frequency] —
Series — Fusion (M1AFS600)
Number of System Gates — 600000 gates
Logic Cells — 13824
Number of I/Os — 172
Memory Bits (DigiKey listing) — 110592 bits
Embedded Processor — ARM Cortex-M1
Core Supply Voltage — 1.5 V
Frequency (per FindIC listing) — 1098.9 MHz
Encapsulado / Carcasa — FBGA-484 (484-BGA), 1.0 mm pitch
Estilo de montaje — SMD/SMT
Minimum Operating Temperature — -40 C
Maximum Operating Temperature — +85 C
Configuration — Flash-based, live at power-up
Total RAM Blocks — [DATA_NEEDED: total embedded RAM blocks]
Analog Blocks — [DATA_NEEDED: number of analog conditioning blocks]

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