M7AFS600-1FG484I vs M7AFS600-FG484 Comparación
Comparación detallada lado a lado de M7AFS600-1FG484I por Microchip Technology y M7AFS600-FG484 por Microchip Technology. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Microchip Technology
M7AFS600-1FG484I - Fusion FPGA 600K Gates, 484 FBGA | Microchip
M7AFS600-1FG484I ✓ ActivoMicrochip Technology
M7AFS600-FG484 - Fusion FPGA 600K Gates, ARM CoreMP7 | Microchip
M7AFS600-FG484 ✓ ActivoComparación de especificaciones
| Parámetro | M7AFS600-1FG484I | M7AFS600-FG484 |
|---|---|---|
| Marca | Microchip Technology | Microchip Technology |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $198,00 | $236,00 |
| System Gates | 600000 | 600K |
| Programmable Logic Tiles | 110592 | — |
| User I/O | 172 | — |
| Family | Fusion (Flash FPGA with optional ARM CoreMP7 support) | — |
| Process Technology | 130 nm, 7-layer metal, Flash-based CMOS | — |
| Configuration Memory | Nonvolatile Flash, retains program when powered off | — |
| Power-Up Feature | Live at Power-Up (LAPU) | — |
| Supply Voltage (Core) | 1.5 V | — |
| Logic Family | CMOS | — |
| Speed Grade | 1 | — |
| Encapsulado | 484-ball FBGA (FG484), 23 x 23 x 2.44 mm | — |
| Ball Pitch | 1.0 mm | — |
| Temperatura de funcionamiento | Industrial, -40C to +85C | — |
| Tipo de montaje | Surface Mount | — |
| Embedded Processor Support | ARM CoreMP7 | — |
| Estado RoHS | Compliant | — |
| Manufacturer Part Number | — | M7AFS600-FG484 |
| Series | — | M7AFS600 (Fusion) |
| Logic Elements (VersaTiles) | — | 110592 |
| Number of I/Os | — | 172 |
| Embedded Processor | — | ARM CoreMP7 |
| Tensión de alimentación de funcionamiento | — | 1.5 V |
| Technology | — | 130 nm Flash |
| Maximum Operating Frequency | — | 1098.9 MHz |
| Encapsulado / Carcasa | — | 484-ball FBGA (FG484) |
| Package Dimensions | — | 23 x 23 x 2.44 mm |
| Minimum Operating Temperature | — | 0 C |
| Maximum Operating Temperature | — | +70 C |
| Estilo de montaje | — | SMD/SMT |
| Packaging | — | Tray |
| RoHS Compliant | — | Yes |
| Programmability Type | — | In-System Programmable (flash-based, non-volatile) |