M7AFS600-1FGG256I vs M7AFS600-2FGG256I Comparación
Comparación detallada lado a lado de M7AFS600-1FGG256I por Microchip Technology y M7AFS600-2FGG256I por Microchip Technology. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Microchip Technology
M7AFS600-1FGG256I - Fusion FPGA 600K Gates ARM CoreMP7 | Microchip
M7AFS600-1FGG256I ✓ ActivoMicrochip Technology
M7AFS600-2FGG256I - 600K Gate Fusion Mixed-Signal FPGA | Microchip
M7AFS600-2FGG256I ✓ ActivoComparación de especificaciones
| Parámetro | M7AFS600-1FGG256I | M7AFS600-2FGG256I |
|---|---|---|
| Marca | Microchip Technology | Microchip Technology |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $0,00 | $389,60 |
| Family | Fusion (Mixed-Signal Flash FPGA) | Fusion Mixed-Signal FPGA (Actel/Microchip) |
| System Gates | 600K | 600000 |
| Processor Core | ARM CoreMP7 | — |
| Number of I/O | 119 | — |
| Tensión de alimentación de funcionamiento | 1.5 V | — |
| Process Technology | 130 nm, 7-layer metal flash-based CMOS | 130 nm, 7-layer metal, flash-based CMOS |
| Configuration Memory | Flash (nonvolatile) | — |
| System Performance | Up to 350 MHz | 350 MHz |
| Speed Grade | -1 | -2 |
| Minimum Operating Temperature | -40 C | — |
| Maximum Operating Temperature | +85 C | — |
| Encapsulado / Carcasa | 256-Ball FBGA (FGG256) | — |
| Estilo de montaje | SMD/SMT | — |
| Packaging | Tray | Tray |
| Series | M7AFS600 | — |
| Live at Power-Up (LAPU) | Yes | — |
| Estado RoHS | [DATA_NEEDED: RoHS status] | — |
| Analog Subsystem | Integrated ADC, voltage/temperature monitors (per Fusion family datasheet) | — |
| User I/O | — | 119 |
| Flash Memory Blocks | — | 110592 bits |
| Processor Support | — | ARM CoreMP7 |
| Tensión de alimentación | — | 1.5 V (core) |
| Logic Family | — | CMOS |
| Configuration | — | Nonvolatile flash, retains program when powered off, Live at Power-Up (LAPU) |
| Encapsulado | — | 256-LBGA (FBGA-256), 1.0 mm ball pitch |
| Number of Pins/Balls | — | 256 |
| Temperatura de funcionamiento | — | 0 to 70 C |
| Tipo de montaje | — | Surface Mount |