M7AFS600-2FGG256 vs M7AFS600-1FGG256I Comparación
Comparación detallada lado a lado de M7AFS600-2FGG256 por Microchip Technology y M7AFS600-1FGG256I por Microchip Technology. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Microchip Technology
M7AFS600-2FGG256 - 600K Gate Fusion FPGA with ARM | Microchip
M7AFS600-2FGG256 ✓ ActivoMicrochip Technology
M7AFS600-1FGG256I - Fusion FPGA 600K Gates ARM CoreMP7 | Microchip
M7AFS600-1FGG256I ✓ ActivoComparación de especificaciones
| Parámetro | M7AFS600-2FGG256 | M7AFS600-1FGG256I |
|---|---|---|
| Marca | Microchip Technology | Microchip Technology |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $274,05 | $0,00 |
| Family | Fusion Mixed-Signal FPGA | Fusion (Mixed-Signal Flash FPGA) |
| System Gates | 600K | 600K |
| Processor Core | ARM CoreMP7 | ARM CoreMP7 |
| User I/O | 119 | — |
| Dedicated Logic Bits | 110592 bits | — |
| Speed Grade | -2 | -1 |
| Core Supply Voltage | 1.5 V (1.425 V to 1.575 V) | — |
| Technology | 130 nm flash-based | — |
| Configuration | Flash-based (nonvolatile, instant-on) | — |
| Encapsulado | 256-LBGA (FBGA-256, 17x17 mm) | — |
| Tipo de montaje | Surface Mount (SMD/SMT) | — |
| Temperatura de funcionamiento | 0C to +70C | — |
| Packaging | Tray | Tray |
| Manufacturer Standard Lead Time | 16 Weeks (per Mouser, as of 2026-09-02) | — |
| Programmable Type | In-System Programmable (ISP) | — |
| Supplier Device Package | 256-FBGA | — |
| Number of I/O | — | 119 |
| Tensión de alimentación de funcionamiento | — | 1.5 V |
| Process Technology | — | 130 nm, 7-layer metal flash-based CMOS |
| Configuration Memory | — | Flash (nonvolatile) |
| System Performance | — | Up to 350 MHz |
| Minimum Operating Temperature | — | -40 C |
| Maximum Operating Temperature | — | +85 C |
| Encapsulado / Carcasa | — | 256-Ball FBGA (FGG256) |
| Estilo de montaje | — | SMD/SMT |
| Series | — | M7AFS600 |
| Live at Power-Up (LAPU) | — | Yes |
| Estado RoHS | — | [DATA_NEEDED: RoHS status] |
| Analog Subsystem | — | Integrated ADC, voltage/temperature monitors (per Fusion family datasheet) |