MAX166AEPP+ vs MAX166DCPP Comparación
Comparación detallada lado a lado de MAX166AEPP+ por Maxim Integrated y MAX166DCPP por Maxim Integrated. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Maxim Integrated
MAX166DCPP - 5µs 8-Bit ADC with T/H, 20-PDIP | Maxim Integrated
MAX166DCPP ✓ ActivoComparación de especificaciones
| Parámetro | MAX166AEPP+ | MAX166DCPP |
|---|---|---|
| Marca | Maxim Integrated | Maxim Integrated |
| Categoría | ADC/DAC | ADC/DAC |
| Estado del ciclo de vida | NRND | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $5,30 | $8,40 |
| Resolución | 8 bit | 8 bit |
| Architecture | Successive Approximation (SAR) with Track/Hold | — |
| Frecuencia de muestreo | 200 ksps (max) | — |
| Conversion Time | 5 µs (max) | 5 µs |
| Number of Channels | 1 | 1 single-ended input |
| Rango de tensión de entrada | 0 V to +5 V (unipolar); ±5 V (bipolar mode) | — |
| Tensión de alimentación | +5 V (±5%) | — |
| Internal Reference Voltage | +2.46 V | 2.46 V |
| Reference Accuracy | ±1.5% | — |
| Total Unadjusted Error (TUE) | ±1 LSB (max) | — |
| Analog Input Bandwidth | Up to 50 kHz full-scale (386 mV/µs slew) | — |
| Data Interface | Parallel, 8-bit, three-state latched outputs | — |
| Logic Compatibility | CMOS-/TTL-compatible I/O | — |
| Encapsulado | PDIP-20 (0.300 inch, through-hole) | 20-PDIP (Plastic DIP, 0.300 inch) |
| Operating Temperature Grade | Industrial (E suffix) | — |
| Estado RoHS | unknown | Compliant |
| Conversion Method | — | Successive Approximation (SAR) |
| Throughput Rate | — | 200 ksps |
| Input Track/Hold Bandwidth | — | Full-scale signals up to 50 kHz (386 mV/µs slew rate) |
| Analog Supply Voltage | — | +5 V (single supply) |
| Digital Interface | — | Parallel, μP-compatible (RD/CS logic) |
| Rango de temperatura de funcionamiento | — | [DATA_NEEDED: temperature grade code details] |
| Tipo de montaje | — | Through-Hole |
| Número de pines | — | 20 |
| Power Dissipation (typical) | — | 30 mW |
| Process Technology | — | CMOS |