MC34903CS3EK vs MC34903CP5EK Comparación
Comparación detallada lado a lado de MC34903CS3EK por NXP Semiconductors y MC34903CP5EK por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
MC34903CP5EK - 5V/400mA SBC with HS-CAN, 32-SOIC | NXP
MC34903CP5EK ⚠ Última compraComparación de especificaciones
| Parámetro | MC34903CS3EK | MC34903CP5EK |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Voltage Regulators | Specialized PMIC |
| Estado del ciclo de vida | Obsolete | Última compra |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $4,85 | $2,58 |
| Función | System Basis Chip (SBC) - CAN/LIN + LDOs | — |
| Supply Voltage Range | 5.5 V to 28 V | — |
| Number of LDOs | 2 x 3.3 V / 1 x 5 V auxiliary | 2 |
| LDO Output Current (3.3 V) | 400 mA per rail | — |
| Auxiliary LDO Output | 5 V / 100 mA | — |
| CAN Transceiver | High-speed, 1 Mbps | — |
| LIN Transceiver | LIN 2.x compliant | — |
| Wake-up Inputs | 2 or 3 (LIN / CAN / WAKE pin, hardware-selectable) | — |
| Interfaz | SPI for configuration and diagnostics | — |
| Temperatura de funcionamiento | -40 C to +125 C | — |
| Encapsulado | 32-pin SOIC-EP (exposed pad) | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Nivel MSL | [DATA_NEEDED: MSL rating] | 3 (per JEDEC J-STD-020) |
| Estado RoHS | Compliant | Compliant |
| Reset / Watchdog | Programmable | — |
| Typical Quiescent Current | 2 mA (per FindIC listing) | — |
| Product Type | — | System Basis Chip (SBC) with dual LDO + HS-CAN |
| LDO Output Voltage | — | 5.0 V (typ) |
| LDO Output Current (each) | — | 400 mA |
| Rango de tensión de entrada | — | 5.5 V to 28 V |
| Load Dump Tolerance | — | 40 V (max) |
| Quiescent Current (standby) | — | 2 mA (typ) |
| Number of Wake-up Inputs | — | 3 |
| CAN Interface | — | High-Speed CAN (ISO 11898-2/5), up to 1 Mbaud |
| Communication Interface | — | SPI (control/status) |
| Rango de temperatura de funcionamiento | — | -40 °C to +125 °C |
| Package Type | — | SOIC-32 (exposed pad, 7.5 mm body) |
| Automotive Qualification | — | AEC-Q100 qualified |