MC68302CRC16C vs MC68302RC16C Comparación

Comparación detallada lado a lado de MC68302CRC16C por NXP Semiconductors y MC68302RC16C por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.

NXP Semiconductors
MC68302CRC16C MC68302CRC16C - 16MHz IMP M683xx MPU | NXP | Networking

MC68302CRC16C - 16MHz IMP M683xx MPU | NXP | Networking

MC68302CRC16C Obsolete
NXP Semiconductors
MC68302RC16C MC68302RC16C - 16MHz M68000 IMP | NXP Semiconductors

MC68302RC16C - 16MHz M68000 IMP | NXP Semiconductors

MC68302RC16C Nrnd

Comparación de especificaciones

Parámetro MC68302CRC16C MC68302RC16C
Marca NXP Semiconductors NXP Semiconductors
Categoría Microcontrollers Microcontrollers
Estado del ciclo de vida Obsolete NRND
Estado del stock In Stock In Stock
Precio unitario (USD) $28,20 $42,50
Product Type Integrated Multiprotocol Processor (IMP) Microprocessor (MPU) / Integrated Multiprotocol Processor
Core M68000 (M683xx family) 8/16-bit —
Operating Frequency 16 MHz (16.67 MHz) —
Tensión de alimentación 5 V 5 V
Number of Cores 1 1
Bit Width 8/16-bit data bus, 24-bit address bus —
Serial Communication Controllers (SCC) 3 channels —
Serial Management Controllers (SMC) 2 channels —
DMA Channels 7 Up to 4
Timers 3 —
Address Bus Width 24 bit —
Ancho del bus de datos 16 bit 8/16-Bit
Encapsulado 132-PGA (34.5 x 34.5 mm) —
Tipo de montaje Through-Hole (Pin Grid Array) Through-Hole (PGA)
Temperatura de funcionamiento [DATA_NEEDED: operating temperature range] —
Estado RoHS [DATA_NEEDED: RoHS compliance status] RoHS Non-Compliant
Protocols HDLC/SDLC, UART, BISYNC, Transparent —
Manufacturer — NXP Semiconductors
Series — MC68302 (IMP - Integrated Multiprotocol Processor)
Core Architecture — M68000 / MC68000 / MC68008 family
Clock / Operating Frequency — 16 MHz
Maximum Operating Temperature — [DATA_NEEDED: exact operating temperature range]
Package Type — 132-PGA (Pin Grid Array)
Package Dimensions — 34.5 x 34.5 mm
On-Chip Communications Controllers (SCC) — 3 (HDLC/SDLC/UART/Transparent)
On-Chip Serial Management Controllers (SMC) — 2
On-Chip System RAM — Up to 2 Kbytes (dual-ported)
External Chip-Select Lines — Up to 4
Lead Free Status — Contains Lead
Nivel MSL — [DATA_NEEDED: MSL moisture sensitivity level]

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