MC68332GCEH16 vs MC68332AMEH16 Comparación
Comparación detallada lado a lado de MC68332GCEH16 por NXP Semiconductors y MC68332AMEH16 por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
MC68332GCEH16 - 32-Bit CPU32 MCU 16MHz ROMless 132-PQFP | NXP
MC68332GCEH16 ⚠ Última compraNXP Semiconductors
MC68332AMEH16 - 16MHz 32-Bit ROMless MCU | NXP | Industrial
MC68332AMEH16 ✗ Fin de vidaComparación de especificaciones
| Parámetro | MC68332GCEH16 | MC68332AMEH16 |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Última compra | Fin de vida |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $38,75 | $15,45 |
| Core | CPU32 (M683xx 32-bit) | — |
| Bit Width | 32-bit | — |
| Maximum Clock Speed | 16 MHz | — |
| Program Memory Size | ROMless | — |
| RAM Size | 2 KB (2K x 8) | — |
| Number of I/O | 15 | — |
| Encapsulado | 132-BQFP (132-PQFP bumpered, 24.13 x 24.13 mm) | 132-pin PQFP |
| Tipo de montaje | Surface Mount | Surface mount |
| Temperatura de funcionamiento | -40C to +85C | — |
| On-chip Peripherals | TPU (Time Processing Unit), QSM (Queued Serial Module), SIM (System Integration Module) | — |
| Interconnect | Intermodule Bus (IMB) | — |
| Tensión de alimentación | 5 V (typical) | — |
| Estado RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| Nivel MSL | [DATA_NEEDED: MSL level] | — |
| Estado del ciclo de vida | End-of-Life (Last Time Buy per NXP product page) | — |
| Product Type | — | 32-bit microcontroller |
| Processor Core | — | CPU32 |
| Operating Frequency | — | 16 MHz |
| Program Memory | — | ROMless |
| Internal RAM | — | 2 KB |
| Architecture | — | MC683xx ColdFire family |
| Peripheral Modules | — | TPU and QSM |
| System Module | — | SIM |
| Bus Architecture | — | Intermodule bus |
| Package Code | — | BQFP |
| Package Body Size | — | 24.13 mm x 24.13 mm |
| Terminal Form | — | Gull wing |
| Temperature Grade | — | Automotive |
| Core Count | — | 1 |
| Rango de tensión de entrada | — | [DATA_NEEDED: input voltage range] |
| Rango de temperatura de funcionamiento | — | [DATA_NEEDED: operating temperature range] |
| External Memory Interfaces | — | [DATA_NEEDED: external memory interfaces] |
| REACH Status | — | [DATA_NEEDED: REACH status] |
| AEC-Q100 Status | — | [DATA_NEEDED: AEC-Q100 qualification status] |