MC68360RC25L vs MC68360RC33L Comparación
Comparación detallada lado a lado de MC68360RC25L por NXP Semiconductors y MC68360RC33L por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
MC68360RC33L - 33MHz QUICC MPU, 241-PGA | NXP Semiconductors
MC68360RC33L ObsoleteComparación de especificaciones
| Parámetro | MC68360RC25L | MC68360RC33L |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | NRND | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $152,00 | $15,75 |
| Family / Series | MC68360 QUICC (CPU32+ core) | — |
| Core | CPU32+ (32-bit, M68K-compatible) | CPU32+ (M683xx family) |
| Core Count | 1 | — |
| Bus Width | 32-bit | — |
| Frecuencia de reloj máxima | 25 MHz | 33 MHz |
| Tensión de alimentación | 5.0 V | 5 V |
| Temperatura de funcionamiento | 0 C to +70 C | — |
| Encapsulado / Carcasa | 241-PGA (47.24 mm x 47.24 mm) | — |
| Tipo de montaje | Through-hole (PGA) | Through-hole (PGA socket) |
| Serial Communication Channels (SCC) | 4 | — |
| Serial Management Channels (SMC) | 2 | 2 (per SIM block) |
| Serial Peripheral Interface (SPI) | Yes | 1 |
| I2C Controller | Yes | — |
| DMA Channels | Yes (on-chip) | — |
| DRAM Controller | Yes (SIM60) | — |
| Estado RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status - legacy part] |
| Lead-Free | [DATA_NEEDED: lead-free status] | [DATA_NEEDED: lead-free status] |
| Core Architecture | — | 32-bit CISC (68k-derived) |
| Performance | — | approximately 16 MIPS |
| Number of Cores | — | 1 |
| Instruction Cache | — | 4 KB |
| Dual-Port RAM | — | 1 KB |
| Serial Communication Controllers (SCC) | — | 4 |
| Address Bus Width | — | 32-bit (4 GB address space) |
| Rango de temperatura de funcionamiento | — | [DATA_NEEDED: operating temperature] |
| Process Technology | — | 0.57 µm CMOS |
| Encapsulado | — | 241-pin PGA (47.24 mm × 47.24 mm) |
| Packaging Type | — | Tray |