MC68HC908LJ24CPK vs MC68HC908LJ24CPB Comparación
Comparación detallada lado a lado de MC68HC908LJ24CPK por NXP Semiconductors y MC68HC908LJ24CPB por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
MC68HC908LJ24CPK - 8MHz 8-bit HC08 MCU, 24KB FLASH, LCD | NXP
MC68HC908LJ24CPK NrndNXP Semiconductors
MC68HC908LJ24CPB - 8-bit HC08 MCU, 24KB Flash, 8MHz | NXP
MC68HC908LJ24CPB ✓ ActivoComparación de especificaciones
| Parámetro | MC68HC908LJ24CPK | MC68HC908LJ24CPB |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | NRND | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $5,20 | $5,21 |
| Core Processor | HC08 | — |
| Core Size | 8-bit | — |
| Core Speed | 8 MHz | — |
| Program Memory Size | 24 KB (24K x 8) | 24 KB (24K x 8) FLASH |
| Program Memory Type | FLASH | — |
| RAM Size | 768 B | 768 bytes |
| EEPROM Size | [DATA_NEEDED: EEPROM size not listed in retrieved data] | — |
| Number of I/O | 48 | — |
| Supply Voltage (Vcc/Vdd) | 3.0 V to 5.5 V | — |
| Connectivity | I2C, IRSCI, SPI | — |
| Peripherals | LCD driver, LVD, POR, PWM | — |
| Data Converters | A/D 8x8b | — |
| Encapsulado | 80-LQFP (LQFP-80, 12x12 mm, surface-mount) | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Temperatura de funcionamiento | -40 C to +85 C (industrial, suffix C) | — |
| Series | HC08 | HC08 |
| Oscillator Type | Internal | — |
| Estado RoHS | [DATA_NEEDED: not explicitly stated in retrieved data] | Compliant (LFQFP package) |
| Manufacturer | — | NXP Semiconductors (formerly Freescale / Motorola) |
| Core | — | CPU08 (enhanced M68HC08 core) |
| Ancho del bus de datos | — | 8-bit |
| Frecuencia de reloj máxima | — | 8 MHz |
| ADC | — | 6-channel, 10-bit |
| Supply Voltage Range | — | 3.0 V to 5.5 V |
| Rango de temperatura de funcionamiento | — | -40 C to +85 C (industrial) |
| Encapsulado / Carcasa | — | 64-LQFP (10x10 mm, gull-wing) |
| Communication Interfaces | — | I2C, SPI, IRSCI (infrared SCI) |
| Number of I/O Pins | — | 56 (approx.) |
| Nivel MSL | — | 3 (per JEDEC J-STD-020) |
| Lead-Free / Halogen-Free | — | Lead-free (per LFQFP marking) |
| Special Features | — | LCD driver interface, KBI (keyboard interrupt), low-power STOP/WAIT |