MC908KX2CDWER vs MC9RS08KB12CWJ Comparación
Comparación detallada lado a lado de MC908KX2CDWER por NXP Semiconductors y MC9RS08KB12CWJ por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
MC908KX2CDWER - HC08 8-Bit MCU 2KB Flash 16-SOIC | NXP (Tape & Reel)
MC908KX2CDWER ✗ Fin de vidaNXP Semiconductors
MC9RS08KB12CWJ - 8-bit RS08 MCU, 12KB Flash, 20MHz | NXP SOIC-20
MC9RS08KB12CWJ ✓ ActivoComparación de especificaciones
| Parámetro | MC908KX2CDWER | MC9RS08KB12CWJ |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Fin de vida | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $3,52 | $2,32 |
| Core Processor | HC08 (CPU08) | — |
| Core Size | 8-Bit | — |
| Architecture | CISC | — |
| Maximum Clock Speed | 8 MHz | — |
| Program Memory Size | 2 KB (2K x 8) | — |
| Program Memory Type | FLASH | — |
| RAM Size | 192 x 8 | — |
| EEPROM Size | None | — |
| Number of I/O | 13 | — |
| Connectivity | SCI | — |
| Peripherals | LVD, POR, PWM | — |
| Tensión de alimentación | 3.3 V / 5 V | — |
| Encapsulado | 16-SOIC (wide body, DWE) | 20-SOIC (0.295 inch / 7.50 mm body width) |
| Tipo de montaje | Surface Mount | Surface Mount |
| Packaging | Tube | — |
| Part Status | Obsolete / Not For New Designs | — |
| Series | HC08 (M68HC08 Family, KX2) | — |
| Core | — | RS08 (8-bit, HC08-compatible instruction subset) |
| Program Memory (Flash) | — | 12 KB (12K x 8) |
| RAM | — | 126 bytes |
| Maximum CPU Frequency | — | 20 MHz |
| Operating Voltage Range | — | 2.5 V / 3.3 V / 5 V |
| ADC | — | [DATA_NEEDED: ADC channels and resolution] |
| Timers | — | 8-bit timer with PWM channel |
| Analog Comparator | — | Integrated |
| Interrupt Architecture | — | Single global interrupt vector |
| Instruction Set Features | — | HC08 subset + BGND (background debug) |
| Rango de temperatura de funcionamiento | — | [DATA_NEEDED: temperature grade from datasheet] |
| Debug Interface | — | Background Debug Mode (BDM) |
| Estado RoHS | — | [DATA_NEEDED: RoHS status from official source] |
| Lead-Free | — | [DATA_NEEDED: lead-free reflow compatibility] |