MC9S08AC8MFDE vs MC9S08AC16CFDE Comparación
Comparación detallada lado a lado de MC9S08AC8MFDE por NXP Semiconductors y MC9S08AC16CFDE por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
MC9S08AC16CFDE - 8-bit S08 MCU 16KB Flash 40MHz QFN-48 | NXP
MC9S08AC16CFDE ✗ Fin de vidaComparación de especificaciones
| Parámetro | MC9S08AC8MFDE | MC9S08AC16CFDE |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Activo | Fin de vida |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $3,78 | $2,05 |
| Core / Architecture | S08 (HCS08), 8-bit CISC | — |
| Program Flash | 8 KB (8K x 8) | — |
| RAM | 512 B | — |
| Maximum CPU Frequency | 40 MHz | — |
| Tensión de alimentación | 2.7 V to 5.5 V (3.3 V / 5 V supported) | — |
| ADC | 8-channel, 10-bit | — |
| Timers | 16-bit timer/PWM modules | — |
| Communication Interfaces | SCI (UART), SPI | — |
| I/O Pins | [DATA_NEEDED: number of GPIO] | — |
| Encapsulado | 48-VFQFN Exposed Pad (QFN-EP, 7x7 mm) | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Temperatura de funcionamiento | -40C to +125C | [DATA_NEEDED: operating temperature range] |
| On-chip Oscillator | Yes (internal clock source) | — |
| Nivel MSL | [DATA_NEEDED: MSL rating] | — |
| Estado RoHS | Compliant | RoHS Compliant |
| Core Processor | — | S08 (HCS08) 8-bit CISC |
| Core Size | — | 8-Bit |
| Frecuencia de reloj máxima | — | 40 MHz |
| Flash Memory | — | 16 KB (16K x 8) |
| RAM Size | — | 4 KB |
| Supply Voltage Range | — | 2.7 V to 5.5 V |
| Number of I/O | — | 38 |
| Program Memory Type | — | Flash |
| Package Type | — | 48-QFN-EP (7x7 mm), HVQCCN |
| ADC Resolution | — | [DATA_NEEDED: ADC resolution and channels] |
| Peripherals | — | [DATA_NEEDED: peripheral list (timers, SCI/SPI)] |
| Series | — | S08AC (Flexis series) |
| Life Cycle Stage | — | End of Life (per NXP product page) |
| Package Pin Count | — | 48 |
| Packaging | — | Tray |