MC9S08AC8MFDE vs MC9S08AC16MFDE Comparación
Comparación detallada lado a lado de MC9S08AC8MFDE por NXP Semiconductors y MC9S08AC16MFDE por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | MC9S08AC8MFDE | MC9S08AC16MFDE |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $3,78 | $2,65 |
| Core / Architecture | S08 (HCS08), 8-bit CISC | — |
| Program Flash | 8 KB (8K x 8) | — |
| RAM | 512 B | — |
| Maximum CPU Frequency | 40 MHz | — |
| Tensión de alimentación | 2.7 V to 5.5 V (3.3 V / 5 V supported) | — |
| ADC | 8-channel, 10-bit | — |
| Timers | 16-bit timer/PWM modules | — |
| Communication Interfaces | SCI (UART), SPI | — |
| I/O Pins | [DATA_NEEDED: number of GPIO] | — |
| Encapsulado | 48-VFQFN Exposed Pad (QFN-EP, 7x7 mm) | QFN-48 (7x7 mm) with Exposed Pad |
| Tipo de montaje | Surface Mount | Surface Mount |
| Temperatura de funcionamiento | -40C to +125C | — |
| On-chip Oscillator | Yes (internal clock source) | — |
| Nivel MSL | [DATA_NEEDED: MSL rating] | — |
| Estado RoHS | Compliant | Compliant |
| Core Architecture | — | HCS08 (8-bit) CISC |
| Program Memory Type | — | Flash |
| Program Memory Size | — | 16 KB (16K x 8) |
| RAM Size | — | 1 KB |
| CPU Clock Speed | — | 40 MHz |
| Internal Bus Frequency | — | 20 MHz |
| Supply Voltage Range | — | 2.7 V to 5.5 V |
| Number of I/O Pins | — | 38 |
| Rango de temperatura de funcionamiento | — | -40 C to +125 C |
| Peripherals | — | TPM, ADC, SCI, SPI, I2C |
| Debug Interface | — | Background Debug Mode (BDM) |
| Lead-Free | — | Yes |
| Estado del ciclo de vida | — | Active |