MC9S08AW16CFGE vs MC9S08AW32CFGE Comparación
Comparación detallada lado a lado de MC9S08AW16CFGE por NXP Semiconductors y MC9S08AW32CFGE por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
MC9S08AW16CFGE - S08 8-bit MCU 16KB Flash 40MHz LQFP-44 | NXP
MC9S08AW16CFGE NrndComparación de especificaciones
| Parámetro | MC9S08AW16CFGE | MC9S08AW32CFGE |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | NRND | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $0,00 | $2,86 |
| Core Processor | S08 (HCS08) | S08 (HCS08) 8-bit CISC |
| Core Size | 8-bit | 8-bit |
| CPU Speed | 40 MHz | — |
| Internal Bus Frequency | 20 MHz | 20 MHz |
| Architecture | CISC, HC08 instruction set with added BGND instruction | — |
| Flash Memory | 16KB (16K x 8) | 32 KB (32K x 8) |
| RAM Size | [DATA_NEEDED: RAM size] | — |
| Supply Voltage Range | 2.7 V to 5.5 V | 2.7 V to 5.5 V |
| I/O Ports | 38 general-purpose I/O | — |
| Debug Interface | Single-wire background debug mode (BDM) | Single-wire background debug mode (BDM) |
| Package Type | 44-LQFP (10x10 mm) | — |
| Package Outline | QFNL, MO-220VKKD-2, 0.50 mm pitch, 1 mm height | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Temperatura de funcionamiento | [DATA_NEEDED: operating temperature range] | [DATA_NEEDED: operating temperature range] |
| Family | S08AW (AW60/AW48/AW32/AW16) | — |
| Target Industries | Industrial and Automotive | — |
| Lifecycle Status (NXP) | NRND (Not Recommended for New Designs) | — |
| Estado RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| Maximum CPU Frequency | — | 40 MHz |
| RAM | — | 2 KB |
| EEPROM | — | [DATA_NEEDED: EEPROM size] |
| ADC Resolution | — | 10-bit |
| ADC Channels | — | 8-channel |
| General Purpose I/O | — | 34 |
| Encapsulado | — | 44-LQFP (10x10 mm), 0.5 mm pitch |
| Package Standard | — | MO-220VKKD-2, 7 x 7 mm body variants per distributor listing |
| Instruction Set | — | HC08 instruction set with added BGND instruction |
| Estado del ciclo de vida | — | NRND (Not Recommended for New Designs) |